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Blind vs Buried Vias: Expert Guide for PCB Prototyping

Even though some information concerning circuit board prototyping has been around for a while, it can be pretty confusing to get direct answers. There is a lot of information out there, and even the most experienced of engineers can have a problem differentiating between what information is right and wrong concerning their specific prototype PCBs. One example of this is the difference between blind vias and buried vias within the board. Here’s everything to know about this technique.

What exactly are blind and buried vias?
We all know that a copper track on a printed circuit board is a conductive path used to connect two points in the PCB.

A Blind Via:
A blind via is a copper plated hole that is interconnected to only one external layer of the PCB. However, it is important to know that the hole does not go all the way to the board, making it “blind” or “invisible” to the naked eye.

A Buried Via:
On the other hand, a buried via connects at least two layers without going to the outer edges of the board. Hence, it is buried within the circuit and completely internal.

Other helpful information concerning blind and buried vias in prototype PCB fabrication:
Generally speaking, these two types of vias are used for more high-density circuit boards, as simple boards don’t really need different design structures since they are only composed of one layer.

A Blind Via:

A Buried Via:

Drilling can only go so deep when it comes to prototype circuit boards. This is why you should always deal with a professional when handling buried and blind vias. Don’t be afraid to call us today with any and all of your questions!


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