DATA MODUL Launches Hybrid Bonding Technology for High‑Volume Industrial Touch Displays

The professional and industrial sectors continue to demand higher‑performance touch displays across a broad range of sizes, technologies, and volumes. To meet this evolving need, DATA MODUL is expanding its bonding portfolio with a new hybrid bonding process.

Hybrid bonding is a breakthrough technology that fuses the best features of liquid (LOCA) and dry (OCA) lamination methods. Since May 2019, the company has successfully installed and commissioned a fully automated hybrid bonding machine in the extended clean room at its Weikersheim production site, becoming one of the first European providers of this solution.

In a traditional bonding cycle, the touch panel, glass substrate, and display module are bonded automatically with either liquid or dry adhesive and then cured. Hybrid bonding combines the speed and precision of LOCA with the high‑resolution alignment of OCA, delivering superior performance and reduced cycle times.

From a cost‑perspective and because of its rapid set‑up, hybrid bonding is especially attractive for high‑volume projects. The Munich‑based specialist now offers the widest range of in‑house bonding options, giving industrial customers unparalleled flexibility in display optimization.

Looking ahead, DATA MODUL plans to expand its facility with additional OCA and LOCA bonding machines, ensuring maximum production agility for large‑scale industrial projects.