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EN 1977 Grade Cu-HCP H040: High-Purity Deoxidized Copper for Vacuum Applications

Cu-DHP, mat. No CW021A, is a deoxidized copper with low phosphorus-content. To the comparable DIN-mark SF-Cu, mat. No 2.0070 acc. to DIN 1787: 1973-01 (precondition for the comparability: Cu-content min. 99,95%, deoxidation agent phosphorus) applies: The material is also available in a special quality free of steam stripping elements. This is very important for vacuum technology. Tensile strength and Brinell hardness are increasable by cold forming. SE-Cu is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: good burnishing: good Application: Preferably application in electrical engineering, electronics. For production of all types of semifinished parts when high electrical conductivity is demanded as well as in vacuum technology and as cladding material.

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 - 8.94 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

127 - 129 GPa

Hardness, Brinell

20.0 °C

40 [-]

Hardness, Vickers

20.0 °C

40 - 65 [-]

Poisson's ratio

20.0 °C

0.34 [-]

Shear modulus

23.0 °C

48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

200 MPa

Yield strength Rp0.2

20.0 °C

50 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.69E-5 1/K

200.0 °C

1.73E-5 1/K

300.0 °C

1.76E-5 1/K

Melting point

965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

20.0 °C

385 - 390 J/(kg·K)

100.0 °C

393 J/(kg·K)

200.0 °C

403 J/(kg·K)

Thermal conductivity

20.0 °C

385 - 386 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.70E+7 S/m

Electrical resistivity

20.0 °C

1.8E-8 Ω·m

Specific Electrical conductivity

98 % IACS

Chemical properties

PropertyValue

Bismuth

5E-4 %

Copper

99.95 %

Lead

5E-3 %

Phosphorus

2E-3 - 7E-3 %


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