QMet™ 300 Strip: High-Performance Copper Alloy for Superior Conductivity & Reliability

Materion Performance Alloys’ QMet 300 strip is a high-performance, heat treated copper alloy designed to provide very high electrical and thermal conductivity while still retaining moderate strength. This non beryllium-containing alloy is idea for heat spreading structural components in consumer electronic devices as well as high reliability, high power electrical and electronic connectors.

Properties

General

Property	Temperature	Value
Density	23.0 °C	8.89 g/cm³

Dimension

Property	Value	Comment
Thickness	0.2 - 0.8 mm	gauge

Mechanical

Property	Temperature	Value	Comment
Bendability 90°, bw	23.0 °C	0.2 [-]
Bendability 90°, gw	23.0 °C	0.2 [-]
Elastic modulus	23.0 °C	137 - 152 GPa
Elongation	23.0 °C	5 - 9 %	for strip thicker than 0.10 mm
Hardness, Vickers	23.0 °C	130 - 170 [-]
Poisson's ratio	23.0 °C	0.3 [-]
Tensile strength	23.0 °C	538 - 558 MPa
Yield strength Rp0.2	23.0 °C	500 - 536 MPa

Thermal

Property	Temperature	Value
Coefficient of thermal expansion	23.0 °C	1.8E-5 1/K
Thermal conductivity	23.0 °C	341 W/(m·K)

Electrical

Property	Temperature	Value
Electrical conductivity	23.0 °C	4.70E+7 S/m
Specific Electrical conductivity		78 - 81 % IACS

Chemical properties

Property	Value	Comment
Chromium	0.5 - 3 %	Ni+Si+Cr
Copper	99.5 %	min.
Nickel	0.5 - 3 %	Ni+Si+Cr
Silicon	0.5 - 3 %	Ni+Si+Cr

Technological properties

Property
Application areas	Automotive Wire Harness Terminals and High Voltage Connectors, EV Charging Contacts, Appliance Power Contacts, Computer Power Contacts, Backplane, Midplane and Card Edge Connectors, Photovoltaic System Connectors, Heat Spreading for Consumer Electronics

QMet™ 200 Strip – High‑Performance Copper Alloy for Superior Conductivity and Reliability M25 High-Performance Copper Alloy Wire (C17300) – Free Machining & RF Connectivity

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