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EN 12164 Grade CuSP R300 – High-Performance Unhardenable Copper Alloy

CuSP, mat. No CW114C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuSP, mat. No 2.1498, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. Already low S-contents increase the temperature for removal of workhardening to approx. 300°C. CuSP shows roughly the same electrical and thermal conductivity as pure copper. The corrosion resistance is equal to unalloyed copper. Processing properties: hot forming: moderately cold forming: good machinability: very good soft soldering: good hard soldering: moderately gas shielded welding: unfavorable burnishing: good Application: For screw machine parts and clamps in electronics, for nozzle, welding and cutting torches as well as for engine parts, valves and fittings.

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

120 GPa

Elongation

20.0 °C

5 %

Elongation A10

20.0 °C

3 %

Elongation A100

20.0 °C

2 %

Elongation A11.3

20.0 °C

3 %

Hardness, Brinell

20.0 °C

95 - 130 [-]

Poisson's ratio

23.0 °C

0.34 [-]

Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

300 MPa

Yield strength Rp0.2

20.0 °C

240 - 250 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.69E-5 1/K

200.0 °C

1.73E-5 1/K

300.0 °C

1.76E-5 1/K

Melting point

965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

20.0 °C

385 J/(kg·K)

100.0 °C

394 J/(kg·K)

200.0 °C

406 J/(kg·K)

Thermal conductivity

20.0 °C

374 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.00E+7 S/m

Specific Electrical conductivity

86 % IACS

Chemical properties

PropertyValue

Phosphorus

0 - 0.01 %

Sulfur

0.2 - 0.7 %


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