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ASTM B197 Grade C17200 TM08 – Superior Strength & Conductivity Copper Alloy

Materion Performance Alloys’ Alloy 25 wire provides the highest strength of any copper alloy, with electrical conductivity considerably greater than other high strength copper alloys. This alloy features good stress relaxation resistance and high fatigue strength.

Properties

General

PropertyTemperatureValue

Density

23.0 °C

8.36 - 8.8 g/cm³

Dimension

PropertyValue

Diameter

1.27 - 12.7 mm

Mechanical

PropertyTemperatureValue

Elastic modulus

23.0 °C

130 - 131 GPa

Elongation

23.0 °C

2 - 15 %

Tensile strength

23.0 °C

750 - 1260 MPa

Yield strength

23.0 °C

1140 MPa

Yield strength Rp0.2

23.0 °C

620 - 870 MPa

Thermal

PropertyTemperatureValue

Coefficient of thermal expansion

23.0 °C

1.75E-5 - 1.8E-5 1/K

Melting point

870 °C

Specific heat capacity

23.0 °C

360 J/(kg·K)

Thermal conductivity

23.0 °C

105 - 110 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical resistivity

23.0 °C

6.2E-6 - 7.8E-6 Ω·m

Specific Electrical conductivity

22 - 28 % IACS

Chemical properties

PropertyValueComment

Aluminium

0 - 0.2 %

Beryllium

1.8 - 2 %

Cobalt

0.2 %

min. Nickel + Cobalt

Copper

96.1 - 98 %

Balance

Iron

0 - 0.6 %

max., Nickel + Cobalt + Iron

Nickel

0.2 - 0.6 %

min. Nickel + Cobalt

Other

0 - 0.5 %

Silicon

0 - 0.2 %

Technological properties

Property
Application areas

Typical applications include precision coil springs and pins for burn-in and test socket contacts and probe pins, computer processor socket contacts, cold headed fasteners, modular jack contacts, woven mesh electromagnetic shielding gaskets and resilient eyeglass frames.


Metal

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  5. High-Strength Copper Alloy C17200 (ASTM B197) – Superior Performance & Conductivity
  6. ASTM B197 Grade C17300 TD04 – High-Performance Copper Alloy for RF & Coaxial Applications
  7. M25 Copper Alloy – High‑Performance, Free‑Machining Solution for RF Connectors (ASTM B197 Grade C17300)
  8. ASTM B196 Grade C17200 (TM00) – High-Strength Copper Alloy for Advanced Applications
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