Harwin’s S0911-46R: Ultra‑Compact EMI/RFI Shield Clip for High‑Density Electronics

Covering just 2.3 × 1.2 mm of board surface and standing 2 mm tall, Harwin’s S0911‑46R is the smallest surface‑mount EMI/RFI shield clip available today. Its Beryllium Copper construction plated with Tin‑over‑Nickel delivers excellent conductivity and corrosion resistance, allowing it to clamp even the thinnest shielding cans—up to 0.2 mm thick—while fitting cans with only 1 mm side lengths. The result is minimal footprint on the PCB, preserving precious real estate in ultra‑compact designs.

The companion S0921‑46R corner clip enhances protection by sealing gaps at the edges of shielding cans. It accommodates Harwin’s 0.3 mm thick cans and occupies just 6 mm² of PCB area, ensuring seamless coverage without compromising space.

By adopting a clip‑based mounting strategy, engineers eliminate the need for soldering shield cans to the board. This simplifies manufacturing, reduces cycle times, and lowers environmental impact by removing solder usage and associated heat‑sink concerns. The clips also allow for rapid installation, easy removal for inspection, and flexible reconfiguration—key advantages in iterative design and field service.

Ideal for space‑constrained applications—including wearables (smart watches, fitness trackers), IoT sensor nodes, and portable consumer devices (smartphones, action cameras)—the S0911‑46R series operates reliably from –55 °C to +105 °C. Packaged in tape‑and‑reel format, they are ready for automated production lines.