Molex Unveils MicroTPA 2.00 mm Wire‑to‑Board & Wire‑to‑Wire Connector System for High‑Temperature, High‑Reliability Applications
Molex introduces the MicroTPA 2.00 mm Wire‑to‑Board and Wire‑to‑Wire Connector System, engineered for demanding high‑temperature environments while delivering uncompromised electrical and mechanical reliability.
Designed for compact spaces in consumer and automotive electronics, the system supports up to 15 circuits, a 2.5 A current rating, and a temperature range of –40 °C to +105 °C. It accommodates cables from 0.85 mm to 1.50 mm in diameter and a wide variety of wire sizes, thanks to the industry‑favorite crimp terminals and TPA retainers.
Key features include a positive lock structure, RoHS compliance, vertical through‑hole headers, and a 2.00 mm pitch that simplifies integration with existing PCB layouts. The MicroTPA’s high‑temperature capability and robust construction make it an ideal choice for applications where space, reliability, and compliance are paramount.
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