SECO Unveils Tomorrow's IoT Solutions at Computex Taipei 2019

At Computex Taipei 2019, SECO, a global leader in embedded platforms, unveiled a portfolio of modular solutions that reinforce its cross‑platform vision. The lineup, built on cutting‑edge technologies and industry‑standard form factors—Qseven, COM Express and SMARC—demonstrates the company’s commitment to flexibility, scalability and reliability.

SECO’s Qseven family showcases the full breadth of the NXP i.MX 8 line, including the Q7‑C26 module powered by the i.MX 8 Applications Processor. The Q7‑C26 offers extensive connectivity and a rich M2M interface, while the Q7‑C25 hosts the i.MX 8M processor. Additional Qseven modules integrate Intel Atom X, Celeron J/N, Pentium N and Atom E3800/Celeron families, delivering performance across a spectrum of embedded workloads.

The company highlighted the versatility of the COM Express form factor with three new Intel‑based modules. The COMe‑C55‑CT6 is a Compact 3.0 Type 6 board that houses 8th‑Gen Intel Core and Celeron U‑series CPUs (Whiskey Lake). The COMe‑C24‑CT6 brings the Apollo Lake Atom, Celeron J/N and Pentium N families to the Compact 3.0 platform, while the COMe‑C08‑BT6 supports 8th‑Gen Intel Core/Xeon (Coffee Lake H). In addition, the COMe‑B75‑CT6, a Compact 3.0 Type 6 module, runs AMD Ryzen Embedded V1000 processors.

Among the highlight of the SMARC segment is the SM‑B71, a Rel. 2.0‑compliant board that houses the Xilinx Zynq UltraScale+ MPSoC. The module fuses an ARM Cortex‑A53 MPSoC with up to 256k FPGA logic cells, providing a cost‑effective yet powerful heterogeneous platform that can be tailored to any application—from low‑power edge devices to high‑performance embedded systems.

SECO also introduced its brand‑new Industrial Internet of Things platform—a comprehensive B2B service that leverages AI and Big Data to transform traditional manufacturing into Smart Industry. The platform offers real‑time analytics, predictive maintenance, and end‑to‑end connectivity, enabling enterprises to unlock new efficiencies and revenue streams.

Finally, SECO’s booth spotlighted its DIY and open‑source hardware family. The UDOO BOLT, an AI‑first single‑board computer powered by an AMD Ryzen Embedded V1000 SoC, supports Arduino‑compatible I/O for rapid prototyping. The next‑generation UDOO X86II brings an Intel Quad‑Core 64‑bit processor and an Arduino Leonardo microcontroller, giving developers a versatile, low‑cost platform for industrial and hobbyist projects alike.