EN 1652 Cu‑ETP R200 – Premium Oxygen‑Free Copper for Superior Conductivity

Cu-ETP, mat. No CW004A, is an oxygenous copper with Cu >= 99,9%. To the comparable DIN-mark E-Cu58, mat. No 2.0065 acc. to DIN 1787 : 1973-01 applies: The most excellent material property is its high thermal and electrical conductivity. Tensile strength and Brinell hardness are increasable by cold forming. The material does not show any embrittlement at low temperatures and has a high corrosion resistance particularly to drinking and industrial water. It is not hydrogen resistant. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: good soft soldering: very good gas-shielded welding: moderately burnishing: very good Application: Due to the very high conductivity use in electrical engineering, electronics application. Furthermore in food and beverage industry, refrigeration and air-condition technology, in machine, ship, apparatus and vehicle engineering, in household as well as for hardware, in handcraft and in construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Properties

General

Mechanical

Thermal

Electrical

Chemical properties