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EN 1652 Cu-DLP R200 – Premium Deoxidized Copper for Superior Performance

Cu-DLP, mat. No CW023A, is a deoxidized copper with limited, low residual copper-content. To the comparable DIN-make SW-Cu, mat. No 2.0076 acc. to DIN 1787 : 1973-01 applies: Tensile strength and Brinell hardness are increasable by cold forming. SW-Cu is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: good burnishing: very good Application: Preferably in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 - 8.94 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

129 - 132 GPa

Elongation

20.0 °C

33 - 42 %

Hardness, Vickers

20.0 °C

55 [-]

Poisson's ratio

20.0 °C

0.34 [-]

Shear modulus

23.0 °C

48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

200 - 250 MPa

Yield strength Rp0.2

20.0 °C

40 - 100 MPa

Yield strength Rp1.0

50.0 °C

60 MPa

100.0 °C

55 MPa

150.0 °C

55 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

Typical for Wrought Copper Pure / Low Alloyed Copper

Melting point

965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

20.0 °C

385 - 386 J/(kg·K)

Thermal conductivity

20.0 °C

350 - 352 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.20E+7 S/m

Electrical resistivity

20.0 °C

1.9E-8 Ω·m

Chemical properties

PropertyValue

Bismuth

5E-4 %

Copper

99.9 %

Lead

5E-3 %

Phosphorus

0.01 %


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