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EN 12168 Grade CuSP H080 – Low Alloy Copper with High Conductivity and Cold‑Forming Strength

CuSP, mat. No CW114C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuSP, mat. No 2.1498, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. Already low S-contents increase the temperature for removal of workhardening to approx. 300°C. CuSP shows roughly the same electrical and thermal conductivity as pure copper. The corrosion resistance is equal to unalloyed copper. Processing properties: hot forming: moderately cold forming: good machinability: very good soft soldering: good hard soldering: moderately gas shielded welding: unfavorable burnishing: good Application: For screw machine parts and clamps in electronics, for nozzle, welding and cutting torches as well as for engine parts, valves and fittings.

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

120 GPa

Hardness, Brinell

20.0 °C

80 - 130 [-]

Hardness, Vickers

20.0 °C

90 - 140 [-]

Poisson's ratio

23.0 °C

0.34 [-]

Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

250 MPa

Yield strength Rp0.2

20.0 °C

200 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.69E-5 1/K

200.0 °C

1.73E-5 1/K

300.0 °C

1.76E-5 1/K

Melting point

965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

20.0 °C

385 J/(kg·K)

100.0 °C

394 J/(kg·K)

200.0 °C

406 J/(kg·K)

Thermal conductivity

20.0 °C

374 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.00E+7 S/m

Specific Electrical conductivity

86 % IACS

Chemical properties

PropertyValue

Phosphorus

0 - 0.01 %

Sulfur

0.2 - 0.7 %


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