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EN 12168 Grade CuTeP H080: High-Performance Copper Alloy for Superior Machining

CuTeP, mat. No CW118C, is counted among unhardenable, low alloyed copper alloys. To the comparable make CuTeP, mat. No 2.1546, acc. to DIN 17666 : 1983-12 applies: A strength increase is achievable only by cold forming. CuTeP is applicated as free-cutting alloy due to its favorable machinability. The alloy shows a higher temperature for removal of workhardening (350°C) compared to pure copper. CuTeP shows roughly the same electrical conductivity and corrosion resistance as copper. Processing properties: hot forming: very good cold forming: good machinability: very good soft and hard soldering: good gas shielded welding: good burnishing: good Application: In electronics and electrical engineering, e.g. for small parts such as diode bases and transistors. For welding torch nozzles, screws, nuts, parts for screw connections and fitting components.

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

120 GPa

Hardness, Brinell

20.0 °C

80 - 130 [-]

Hardness, Vickers

20.0 °C

90 - 140 [-]

Poisson's ratio

23.0 °C

0.34 [-]

Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

250 MPa

Yield strength Rp0.2

20.0 °C

200 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

300.0 °C

1.8E-5 1/K

Melting point

965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

23.0 °C

377 - 420 J/(kg·K)

Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal conductivity

20.0 °C

368 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

5.00E+7 - 5.45E+7 S/m

Specific Electrical conductivity

86 % IACS

Chemical properties

PropertyValue

Phosphorus

0 - 0.01 %

Tellurium

0.4 - 0.7 %


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