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EN 12735-1 Grade Cu-DHP R220 – Premium Deoxidized Copper for Advanced Applications

Cu-DHP, mat. No CW024A, is a phosphoric pure copper grade. To the comparable DIN-mark SF-Cu, mat. No 2.0090 acc. to DIN 1787 applies: The material is a deoxidized copper with Cu >= 99,9% and a high residual copper-content. Tensile strength and Brinell hardness are increasable by cold forming. SF-Cu (Cu-DHP) is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: SF-Cu is the most important copper-grade for pipes due to its very good soldering and welding properties. Further application in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 - 8.94 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

-253.0 °C

138 GPa

-195.0 °C

136 GPa

-100.0 °C

133 GPa

20.0 °C

128 - 132 GPa

50.0 °C

127 GPa

100.0 °C

125 GPa

150.0 °C

122 GPa

200.0 °C

120 GPa

250.0 °C

118 GPa

Elongation

20.0 °C

40 - 42 %

Elongation A50

20.0 °C

33 %

Elongation, transverse

20.0 °C

42 %

Hardness, Vickers

20.0 °C

40 - 70 [-]

Poisson's ratio

20.0 °C

0.34 [-]

Shear modulus

23.0 °C

48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

220 - 260 MPa

50.0 °C

145 - 220 MPa

100.0 °C

220 MPa

150.0 °C

195 MPa

200.0 °C

170 MPa

250.0 °C

145 MPa

Tensile strength, transverse

20.0 °C

220 MPa

50.0 °C

220 MPa

100.0 °C

220 MPa

150.0 °C

195 MPa

200.0 °C

170 MPa

250.0 °C

145 MPa

Yield strength Rp0.2

20.0 °C

45 - 140 MPa

Yield strength Rp0.2, transverse

20.0 °C

45 MPa

Yield strength Rp1.0

20.0 °C

65 MPa

50.0 °C

58 - 65 MPa

100.0 °C

58 MPa

150.0 °C

58 MPa

Yield strength Rp1.0, transverse

20.0 °C

65 MPa

50.0 °C

65 MPa

100.0 °C

58 MPa

150.0 °C

58 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.68E-5 1/K

200.0 °C

1.73E-5 1/K

300.0 °C

1.77E-5 1/K

Melting point

965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

-150.0 °C

282 J/(kg·K)

-50.0 °C

361 J/(kg·K)

20.0 °C

386 J/(kg·K)

100.0 °C

393 J/(kg·K)

200.0 °C

403 J/(kg·K)

300.0 °C

415 J/(kg·K)

Thermal conductivity

20.0 °C

305 - 340 W/(m·K)

50.0 °C

310 W/(m·K)

100.0 °C

318 W/(m·K)

200.0 °C

326 W/(m·K)

300.0 °C

334 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

4.30E+7 S/m

50.0 °C

4.10E+7 S/m

100.0 °C

3.70E+7 S/m

200.0 °C

3.40E+7 S/m

300.0 °C

3.00E+7 S/m

Electrical resistivity

20.0 °C

2.2E-8 Ω·m

50.0 °C

2.4E-8 Ω·m

100.0 °C

2.7E-8 Ω·m

200.0 °C

2.9E-8 Ω·m

300.0 °C

3.3E-8 Ω·m

Chemical properties

PropertyValue

Copper

99.9 %

Phosphorus

0.02 - 0.04 %

Silver

0.02 %


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