EN 1057 Cu-DHP M20: Premium Phosphoric Copper for Superior Strength & Reliability
Cu-DHP, mat. No CW024A, is a phosphoric pure copper grade. To the comparable DIN-mark SF-Cu, mat. No 2.0090 acc. to DIN 1787 applies: The material is a deoxidized copper with Cu >= 99,9% and a high residual copper-content. Tensile strength and Brinell hardness are increasable by cold forming. SF-Cu (Cu-DHP) is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: SF-Cu is the most important copper-grade for pipes due to its very good soldering and welding properties. Further application in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 20.0 °C | 8.9 - 8.94 g/cm³ |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elastic modulus | -253.0 °C | 138 GPa | |
-195.0 °C | 136 GPa | ||
-100.0 °C | 133 GPa | ||
20.0 °C | 128 - 132 GPa | ||
50.0 °C | 127 GPa | ||
100.0 °C | 125 GPa | ||
150.0 °C | 122 GPa | ||
200.0 °C | 120 GPa | ||
250.0 °C | 118 GPa | ||
Poisson's ratio | 20.0 °C | 0.34 [-] | |
Shear modulus | 23.0 °C | 48 GPa | Typical for Wrought Copper Pure / Low Alloyed Copper |
Tensile strength | 20.0 °C | 221 MPa | |
65.0 °C | 221 MPa | ||
121.0 °C | 207 MPa | ||
177.0 °C | 186 MPa | ||
204.0 °C | 181 MPa | ||
Yield strength Rp0.2 | 20.0 °C | 97 MPa | |
65.0 °C | 97 MPa | ||
121.0 °C | 96 MPa | ||
177.0 °C | 96 MPa | ||
204.0 °C | 90 MPa | ||
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 100.0 °C | 1.68E-5 1/K | |
200.0 °C | 1.73E-5 1/K | ||
300.0 °C | 1.77E-5 1/K | ||
Melting point | 965 - 1100 °C | Typical for Wrought Copper Pure / Low Alloyed Copper | |
Specific heat capacity | -150.0 °C | 282 J/(kg·K) | |
-50.0 °C | 361 J/(kg·K) | ||
20.0 °C | 386 J/(kg·K) | ||
100.0 °C | 393 J/(kg·K) | ||
200.0 °C | 403 J/(kg·K) | ||
300.0 °C | 415 J/(kg·K) | ||
Thermal conductivity | 20.0 °C | 305 - 340 W/(m·K) | |
50.0 °C | 310 W/(m·K) | ||
100.0 °C | 318 W/(m·K) | ||
200.0 °C | 326 W/(m·K) | ||
300.0 °C | 334 W/(m·K) | ||
Electrical
| Property | Temperature | Value |
|---|---|---|
Electrical conductivity | 20.0 °C | 4.30E+7 S/m |
50.0 °C | 4.10E+7 S/m | |
100.0 °C | 3.70E+7 S/m | |
200.0 °C | 3.40E+7 S/m | |
300.0 °C | 3.00E+7 S/m | |
Electrical resistivity | 20.0 °C | 2.2E-8 Ω·m |
50.0 °C | 2.4E-8 Ω·m | |
100.0 °C | 2.7E-8 Ω·m | |
200.0 °C | 2.9E-8 Ω·m | |
300.0 °C | 3.3E-8 Ω·m | |
Chemical properties
| Property | Value |
|---|---|
Copper | 99.9 % |
Phosphorus | 0.02 - 0.04 % |
Metal
- EN 12166 Grade Cu-DHP H090 – High-Performance Phosphoric Pure Copper
- EN 12163 Cu-DHP H065 – High‑Purity Hydrogen‑Resistant Copper for Advanced Engineering
- EN 12163 Grade Cu-DHP H075: High-Purity Phosphoric Copper for Superior Performance
- EN 12163 Grade Cu-DHP H100: Premium Phosphoric Copper for Superior Conductivity & Corrosion Resistance
- EN 12166 Grade Cu-DHP R270 – Premium Deoxidized Copper for High-Performance Applications
- EN 12166 Cu‑DHP R330 – Premium Deoxidized Copper for High‑Performance Applications
- EN 12165 Grade Cu-DHP H040 – Ultra‑Pure Deoxidized Copper for High‑Performance Applications
- EN 12166 Grade Cu-DHP R250 – High-Purity Deoxidized Copper for Precision Applications
- EN 12163 Cu‑DHP R250 – Premium Phosphoric Copper with High Purity & Hydrogen Resistance
- EN 12735-1 Cu-DHP R200 – High‑Purity Deoxidized Copper for Superior Electrical & Thermal Performance