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EN 12166 Cu‑DHP R330 – Premium Deoxidized Copper for High‑Performance Applications

Cu-DHP, mat. No CW024A, is a phosphoric pure copper grade. To the comparable DIN-mark SF-Cu, mat. No 2.0090 acc. to DIN 1787 applies: The material is a deoxidized copper with Cu >= 99,9% and a high residual copper-content. Tensile strength and Brinell hardness are increasable by cold forming. SF-Cu (Cu-DHP) is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: very good burnishing: very good Application: SF-Cu is the most important copper-grade for pipes due to its very good soldering and welding properties. Further application in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.94 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

95 - 98 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Elongation A10

20.0 °C

7 %

Elongation A100

20.0 °C

4 %

Poisson's ratio

23.0 °C

0.34 [-]

Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Tensile strength

20.0 °C

330 MPa

Yield strength Rp0.2

20.0 °C

290 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.68E-5 1/K

200.0 °C

1.73E-5 1/K

300.0 °C

1.77E-5 1/K

Melting point

965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

-150.0 °C

282 J/(kg·K)

-50.0 °C

361 J/(kg·K)

20.0 °C

386 J/(kg·K)

100.0 °C

393 J/(kg·K)

200.0 °C

403 J/(kg·K)

300.0 °C

415 J/(kg·K)

Thermal conductivity

20.0 °C

305 W/(m·K)

50.0 °C

310 W/(m·K)

100.0 °C

318 W/(m·K)

200.0 °C

326 W/(m·K)

300.0 °C

334 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

4.30E+7 S/m

50.0 °C

4.10E+7 S/m

100.0 °C

3.70E+7 S/m

200.0 °C

3.40E+7 S/m

300.0 °C

3.00E+7 S/m

Electrical resistivity

20.0 °C

2.2E-8 Ω·m

50.0 °C

2.4E-8 Ω·m

100.0 °C

2.7E-8 Ω·m

200.0 °C

2.9E-8 Ω·m

300.0 °C

3.3E-8 Ω·m

Chemical properties

PropertyValue

Copper

99.9 %

Phosphorus

0.02 - 0.04 %


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