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EN 13148 Cu-DHP H110: High-Quality Hot-Dip Tinned Copper Strip

Hot-dip tinned strip.

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.9 - 8.94 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

20.0 °C

132 GPa

Hardness, Brinell

20.0 °C

105 [-]

Hardness, Vickers

20.0 °C

110 [-]

Poisson's ratio

20.0 °C

0.34 [-]

Shear modulus

23.0 °C

48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

100.0 °C

1.68E-5 1/K

200.0 °C

1.73E-5 1/K

300.0 °C

1.77E-5 1/K

Melting point

965 - 1100 °C

Typical for Wrought Copper Pure / Low Alloyed Copper

Specific heat capacity

-150.0 °C

282 J/(kg·K)

-50.0 °C

361 J/(kg·K)

20.0 °C

386 J/(kg·K)

100.0 °C

393 J/(kg·K)

200.0 °C

403 J/(kg·K)

300.0 °C

415 J/(kg·K)

Thermal conductivity

20.0 °C

305 - 340 W/(m·K)

50.0 °C

310 W/(m·K)

100.0 °C

318 W/(m·K)

200.0 °C

326 W/(m·K)

300.0 °C

334 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

4.30E+7 S/m

50.0 °C

4.10E+7 S/m

100.0 °C

3.70E+7 S/m

200.0 °C

3.40E+7 S/m

300.0 °C

3.00E+7 S/m

Electrical resistivity

20.0 °C

2.2E-8 Ω·m

50.0 °C

2.4E-8 Ω·m

100.0 °C

2.7E-8 Ω·m

200.0 °C

2.9E-8 Ω·m

300.0 °C

3.3E-8 Ω·m

Chemical properties

PropertyValue

Copper

99.9 %

Phosphorus

0.02 - 0.04 %


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