Cervoz: Rugged Memory & Storage for Extreme Temperature Environments

ST Microelectronics unveiled at IEDM 2018 the architecture and performance of a 28 nm FD‑SOI MCU featuring embedded Phase‑Change Memory (ePCM). These first‑in‑class MCUs are now sampling with alpha customers, passing field trials that meet automotive specifications, and are slated for full qualifica

Background Printing machine manufacturers rely on fast, reliable storage to keep up with the rapid flow of job data. The client required a storage solution that could sustain continuous, high‑frequency access to small 4‑kilobyte files without compromising speed or reliability. Challenge The system f

In the rapidly evolving landscape of medical technology, Artificial Intelligence is driving unprecedented breakthroughs in diagnostics, patient care, and emergency response. By processing vast datasets and leveraging experience far beyond a single clinician, AI delivers insights that were once unima

Rockwell Automation and Accenture’s Industry X.0 are teaming up to develop a digital offering to help industrial clients “move beyond existing manufacturing solutions to transform their entire connected enterprise”. The engagement is designed to capitalize on the expertise of both companies to del