ROHM Introduces Ultra‑Compact 1.6 × 1.6 mm MOSFETs for Enhanced Automotive Miniaturization

ROHM has unveiled a new line of ultra‑compact 1.6 × 1.6 mm MOSFETs that deliver exceptional mounting reliability. The RV4xxx series, AEC‑Q101 qualified, guarantees automotive‑grade performance even under the most extreme conditions. With ROHM’s proprietary package processing, these components enable the miniaturization of critical automotive parts such as ADAS camera modules, which demand the highest quality and reliability.

The rapid expansion of vehicle safety and convenience systems—particularly ADAS cameras—has heightened the need for space‑saving components. Bottom‑electrode MOSFETs that can be shrunk without sacrificing current capacity are increasingly in demand.

In automotive assembly, optical inspection is essential to verify quality. However, bottom‑electrode devices make it difficult to confirm solder height after mounting, complicating quality assurance.

ROHM’s proven track record of launching market‑leading products is evident with these ultra‑compact MOSFETs. The company is the first in the industry to guarantee a 130 µm electrode height on the package side, achieved through its original Wettable Flank formation technology. This ensures consistent solder quality—even for bottom‑electrode parts—allowing automated inspection machines to reliably verify solder conditions post‑mounting.