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CEN/TS 13388 Standard – Grade CW009A M Copper Specifications

Properties

General

PropertyTemperatureValueComment

Density

23.0 °C

8.9 g/cm³

Typical for Wrought Copper Pure / Low Alloyed Copper

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

95 - 98 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Elongation

23.0 °C

30 %

Poisson's ratio

23.0 °C

0.34 [-]

Typical for Wrought Copper Pure / Low Alloyed Copper

Shear modulus

23.0 °C

48 GPa

Typical for Wrought Copper Pure / Low Alloyed Copper

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.6E-5 - 1.8E-5 1/K

Typical for Wrought Copper Pure / Low Alloyed Copper

Melting point

1083 °C

Specific heat capacity

23.0 °C

377 - 420 J/(kg·K)

Typical for Wrought Copper Pure / Low Alloyed Copper

Electrical

PropertyTemperatureValue

Electrical conductivity

23.0 °C

5.86E+7 S/m

Electrical resistivity

23.0 °C

1.71E-8 Ω·m

Chemical properties

PropertyValue

Antimony

4E-4 %

Arsenic

5E-4 %

Bismuth

2E-4 %

Cadmium

1E-4 %

Copper

99.99 %

Iron

1E-3 %

Lead

5E-4 %

Manganese

5E-4 %

Nickel

1E-3 %

Phosphorus

3E-3 %

Silver

2.5E-3 %

Sulfur

1.5E-3 %

Tellurium

2E-4 %

Tin

2E-4 %

Zinc

1E-4 %

Technological properties

Property
Brazing

hard brazing : very good, soft brazing: very good

Workability

Cold forming degree between anneals: max. 95 %, general (condition): very good


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