CEN/TS 13388: Grade CW021A M – Comprehensive Material Properties
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 23.0 °C | 8.9 g/cm³ |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elastic modulus | 23.0 °C | 110 GPa | |
Elongation | 23.0 °C | 30 % | |
Poisson's ratio | 23.0 °C | 0.34 [-] | Typical for Wrought Copper Pure / Low Alloyed Copper |
Shear modulus | 23.0 °C | 48 GPa | Typical for Wrought Copper Pure / Low Alloyed Copper |
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 20.0 °C | 1.77E-5 1/K | |
100.0 °C | 1.77E-5 1/K | ||
Melting point | 1083 °C | ||
Specific heat capacity | 23.0 °C | 377 - 420 J/(kg·K) | Typical for Wrought Copper Pure / Low Alloyed Copper |
Thermal conductivity | 23.0 °C | 386 W/(m·K) | |
Electrical
| Property | Temperature | Value |
|---|---|---|
Electrical conductivity | 23.0 °C | 5.70E+7 S/m |
Electrical resistivity | 23.0 °C | 1.75E-8 Ω·m |
Chemical properties
| Property | Value |
|---|---|
Bismuth | 5E-4 % |
Copper | 99.95 % |
Lead | 5E-3 % |
Other | total 0.03. excluded Ag, P |
Phosphorus | 2E-3 - 7E-3 % |
Selenium | 2E-4 % |
Technological properties
| Property | ||
|---|---|---|
| Brazing | hard brazing : very good, soft brazing: very good | |
| Workability | Cold forming degree between anneals: max. 95 %, general (condition): very good | |
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