CEN/TS 13388: CW118C R250 Copper Grade – Key Material Properties
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 23.0 °C | 8.9 g/cm³ |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elastic modulus | 23.0 °C | 120 GPa | |
Elongation | 23.0 °C | 7 % | |
Elongation A100 | 23.0 °C | 3 % | |
Hardness, Brinell | 23.0 °C | 90 [-] | |
Hardness, Vickers | 23.0 °C | 90 [-] | |
Poisson's ratio | 23.0 °C | 0.34 [-] | Typical for Wrought Copper Pure / Low Alloyed Copper |
Shear modulus | 23.0 °C | 48 GPa | Typical for Wrought Copper Pure / Low Alloyed Copper |
Tensile strength | 23.0 °C | 250 MPa | |
Yield strength Rp0.2 | 23.0 °C | 200 MPa |
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 20.0 °C | 1.8E-5 1/K | |
100.0 °C | 1.8E-5 1/K | ||
Melting point | 965 - 1100 °C | Typical for Wrought Copper Pure / Low Alloyed Copper | |
Specific heat capacity | 23.0 °C | 377 - 420 J/(kg·K) | Typical for Wrought Copper Pure / Low Alloyed Copper |
Thermal conductivity | 23.0 °C | 368 W/(m·K) | |
Electrical
| Property | Temperature | Value |
|---|---|---|
Electrical conductivity | 23.0 °C | 5.45E+7 S/m |
Electrical resistivity | 23.0 °C | 1.83E-8 Ω·m |
Chemical properties
| Property | Value |
|---|---|
Other | Rest Cu, total 0.1 |
Phosphorus | 0 - 0.01 % |
Tellurium | 0.4 - 0.7 % |
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