CEN/TS 13388 Grade CW114C R250 – Copper Alloy Technical Specifications
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 23.0 °C | 8.9 g/cm³ |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elastic modulus | 23.0 °C | 120 GPa | |
Elongation | 23.0 °C | 7 % | |
Elongation A100 | 23.0 °C | 3 % | |
Hardness, Brinell | 23.0 °C | 90 [-] | |
Hardness, Vickers | 23.0 °C | 90 [-] | |
Poisson's ratio | 23.0 °C | 0.34 [-] | Typical for Wrought Copper Pure / Low Alloyed Copper |
Shear modulus | 23.0 °C | 48 GPa | Typical for Wrought Copper Pure / Low Alloyed Copper |
Tensile strength | 23.0 °C | 250 MPa | |
Yield strength Rp0.2 | 23.0 °C | 200 MPa |
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 20.0 °C | 1.8E-5 1/K | |
100.0 °C | 1.8E-5 1/K | ||
Melting point | 1067 - 1079 °C | ||
Specific heat capacity | 23.0 °C | 377 - 420 J/(kg·K) | Typical for Wrought Copper Pure / Low Alloyed Copper |
Thermal conductivity | 23.0 °C | 370 - 375 W/(m·K) | |
Electrical
| Property | Temperature | Value |
|---|---|---|
Electrical conductivity | 23.0 °C | 5.40E+7 - 5.50E+7 S/m |
Electrical resistivity | 23.0 °C | 1.82E-8 - 1.85E-8 Ω·m |
Chemical properties
| Property | Value |
|---|---|
Other | Rest Cu, total 0.1 |
Phosphorus | 0 - 0.01 % |
Sulfur | 0.2 - 0.7 % |
Technological properties
| Property | ||
|---|---|---|
| Brazing | hard brazing : very good to good, soft brazing: very good | |
| Workability | Cold forming degree between anneals: max. 70 %, general (condition): good | |
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