EN 12163 Grade CuNi1Si R540: High-Performance Copper Alloy with Superior Conductivity & Corrosion Resistance
CuNi1Si, mat. No CW109C, is counted among hardenable, low alloyed copper alloys. To the comparable DIN-make CuNi1,5Si, mat. No 2.0853, acc. to DIN 17666 : 1983-12 applies: The material shows favorable electrical and thermal conductivity, corrosion resistance, high fatigue and creep resistance as well as favorable spring properties. CuNi1Si is in hardened condition resistant to stress corrosion. Temperature for removal of workhardening approximates 450°C. Strength still increases at low-temperature range. Processing properties: hot and cold forming: good machinability: moderately soft soldering: good hard soldering: moderately gas shielded welding: moderately burnishing: good Application: Particularly for aerial line material, such as clamps, mounting links, nuts, high-strength and corrosion resistant screws. Furthermore for wire ropes in electrical overhead line construction, bearing bushings, roller bearing cages, valve guide bushings and springs.
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 20.0 °C | 8.8 - 8.9 g/cm³ |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elastic modulus | 23.0 °C | 110 - 130 GPa | Typical for Wrought Copper High Copper Alloy |
Elongation | 20.0 °C | 10 - 12 % | |
Elongation A100 | 20.0 °C | 4 % | |
Elongation A11.3 | 20.0 °C | 6 % | |
Tensile strength | 20.0 °C | 540 MPa | |
Yield strength Rp0.2 | 20.0 °C | 470 MPa |
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 300.0 °C | 1.68E-5 1/K | |
Melting point | 855 - 1090 °C | Typical for Wrought Copper High Copper Alloy | |
Specific heat capacity | 20.0 °C | 377 J/(kg·K) |
Electrical
| Property | Temperature | Value |
|---|---|---|
Electrical conductivity | 20.0 °C | 2.20E+7 S/m |
Specific Electrical conductivity | 38 % IACS |
Chemical properties
| Property | Value |
|---|---|
Iron | 0.2 % |
Lead | 0.02 % |
Manganese | 0.1 % |
Nickel | 1 - 1.6 % |
Silicon | 0.4 - 0.7 % |
Metal
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