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EtchMet™ TM10 (C17200) Strip – High‑Strength Spring Material for Mobile Devices

EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras. These devices have a relatively large mass (lense) suspended by extremely small, thin springs. The small size of the springs requires very high strength material to withstand shock loads when the phone is dropped or deliberately tapped against an NFC reader. Therefore, the springs must be made from a very robust material. Furthermore, the lack of a damping mechanism makes high spring stiffness important to combat vibration. EtchMet alloy provides a number of advantages that make it the ideal material for this application:


  • It has a uniform elastic modulus across all thicknesses/diameters and from product form to product form. This provides consistent stiffness and damping behavior which makes spring calculations easy.
  • It has a very high resilience allowing it to withstand impact loads without fracturing or permanently deforming.
  • It has high fatigue strength to withstand many drops and actuation cycles.
  • It has a uniform, primarily single-phase microstructure, which photochemically machines easily and cleanly for uniform edges free of stress risers.
  • It is supplied fully precipitation hardened so no further heat treatment is required.
  • It solders and welds readily.
  • EtchMet strip is inherently flat with minimal coil set, which helps with alignment during photochemical machining.
  • Properties

    General

    PropertyTemperatureValue

    Density

    23.0 °C

    8.36 g/cm³

    Dimension

    PropertyValue

    Thickness

    0.03 - 0.05 mm

    Width

    1.27 - 406.5 mm

    Mechanical

    PropertyTemperatureValueComment

    Elastic modulus

    23.0 °C

    131 GPa

    Elongation

    23.0 °C

    3 %

    min.

    Hardness, Vickers

    23.0 °C

    325 [-]

    min.

    Tensile strength

    23.0 °C

    1200 MPa

    min.

    Yield strength Rp0.2

    23.0 °C

    1103 MPa

    min.

    Thermal

    PropertyTemperatureValue

    Coefficient of thermal expansion

    23.0 °C

    1.75E-5 1/K

    Thermal conductivity

    23.0 °C

    105 W/(m·K)

    Electrical

    PropertyTemperatureValue

    Electrical resistivity

    23.0 °C

    6.2E-6 - 1.01E-5 Ω·m

    Specific Electrical conductivity

    17 - 28 % IACS

    Magnetic

    PropertyTemperatureValueComment

    Relative magnetic permeability

    23.0 °C

    1 [-]

    max.

    Technological properties

    Property
    Application areas

    EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras.


    Metal

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