EtchMet® C17200 TD04 Wire – Premium High‑Strength Solution for Smartphone Imaging Systems

EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras. These devices have a relatively large mass (lense) suspended by extremely small, thin springs. The small size of the springs requires very high strength material to withstand shock loads when the phone is dropped or deliberately tapped against an NFC reader. Therefore, the springs must be made from a very robust material. Furthermore, the lack of a damping mechanism makes high spring stiffness important to combat vibration. EtchMet wire provides a number of advantages that make it the ideal material for this application:

It has a uniform elastic modulus across all thicknesses/diameters and from product form to product form. This provides consistent stiffness and damping behavior which makes spring calculations easy.

It has a very high resilience allowing it to withstand impact loads without fracturing or permanently deforming.

It has high fatigue strength to withstand many drops and actuation cycles.

It solders and welds readily.

Properties

General

Property	Temperature	Value
Density	23.0 °C	8.3 - 8.36 g/cm³

Mechanical

Property	Temperature	Value	Comment
Elastic modulus	23.0 °C	131 GPa
Elongation	23.0 °C	1 - 8 %	for wire with 0.1mm diameter and more.
Tensile strength	23.0 °C	960 - 1140 MPa
Yield strength Rp0.2	23.0 °C	890 - 1110 MPa

Thermal

Property	Temperature	Value
Coefficient of thermal expansion	23.0 °C	1.75E-5 1/K
Thermal conductivity	23.0 °C	105 W/(m·K)

Electrical

Property	Temperature	Value
Electrical resistivity	23.0 °C	6.2E-6 - 7.8E-6 Ω·m
Specific Electrical conductivity		22 - 28 % IACS

Magnetic

Property	Temperature	Value	Comment
Relative magnetic permeability	23.0 °C	1 [-]	max.

Chemical properties

Property	Value	Comment
Beryllium	1.8 - 2 %
Cobalt	0.2 %	min. Nickel + Cobalt
Copper	Balance
Iron	0.6 %	max. Nickel + Cobalt + Iron
Nickel	0.2 %	min. Nickel + Cobalt

Technological properties

Property
Application areas	EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras.

EtchMet® C17200 TB00 Wire – Ultra‑Thin, High‑Strength Spring Material for Mobile Devices EtchMet™ C17200 TF00 Wire – High‑Strength Spring Material for Mobile Camera Systems

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