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EtchMet® C17200 TB00 Wire – Ultra‑Thin, High‑Strength Spring Material for Mobile Devices

EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras. These devices have a relatively large mass (lense) suspended by extremely small, thin springs. The small size of the springs requires very high strength material to withstand shock loads when the phone is dropped or deliberately tapped against an NFC reader. Therefore, the springs must be made from a very robust material. Furthermore, the lack of a damping mechanism makes high spring stiffness important to combat vibration. EtchMet wire provides a number of advantages that make it the ideal material for this application:


  • It has a uniform elastic modulus across all thicknesses/diameters and from product form to product form. This provides consistent stiffness and damping behavior which makes spring calculations easy.
  • It has a very high resilience allowing it to withstand impact loads without fracturing or permanently deforming.
  • It has high fatigue strength to withstand many drops and actuation cycles.
  • It solders and welds readily.
  • Properties

    General

    PropertyTemperatureValue

    Density

    23.0 °C

    8.3 - 8.36 g/cm³

    Mechanical

    PropertyTemperatureValueComment

    Elastic modulus

    23.0 °C

    131 GPa

    Elongation

    23.0 °C

    30 - 75 %

    for wire with 0.1mm diameter and more.

    Tensile strength

    23.0 °C

    410 - 585 MPa

    Yield strength Rp0.2

    23.0 °C

    130 - 210 MPa

    Thermal

    PropertyTemperatureValue

    Coefficient of thermal expansion

    23.0 °C

    1.75E-5 1/K

    Thermal conductivity

    23.0 °C

    105 W/(m·K)

    Electrical

    PropertyTemperatureValue

    Electrical resistivity

    23.0 °C

    6.2E-6 - 7.8E-6 Ω·m

    Specific Electrical conductivity

    22 - 28 % IACS

    Magnetic

    PropertyTemperatureValueComment

    Relative magnetic permeability

    23.0 °C

    1 [-]

    max.

    Chemical properties

    PropertyValueComment

    Beryllium

    1.8 - 2 %

    Cobalt

    0.2 %

    min. Nickel + Cobalt

    Copper

    Balance

    Iron

    0.6 %

    max. Nickel + Cobalt + Iron

    Nickel

    0.2 %

    min. Nickel + Cobalt

    Technological properties

    Property
    Application areas

    EtchMet alloy is a material that is tailor made for the springs in voice coil motors and optical image stabilization systems common in smart phone cameras.


    Metal

    1. Alloy 25: High-Strength Copper Alloy for Forging & Extrusion – TB00 (C17200)
    2. EtchMet® C17200 TD04 Wire – Premium High‑Strength Solution for Smartphone Imaging Systems
    3. EtchMet™ C17200 TF00 Wire – High‑Strength Spring Material for Mobile Camera Systems
    4. EtchMet™ C17200 TH04 Wire – Premium High-Strength Wire for Mobile Camera Suspensions
    5. Alloy 25 Wire (TB00 / C17200) – Unmatched Strength & High Conductivity
    6. Alloy 25 Wire TD01 (C17200) – Ultra-High Strength Copper Alloy
    7. Alloy 25 Wire TD02 (C17200) – Highest Strength & Conductivity Copper Alloy
    8. Alloy 3 (C17510) TB00 Wire – High Strength, Excellent Conductivity & Stress Resistance
    9. Alloy 10 (C17500) TB00 Wire – High-Performance Strength & Conductivity
    10. Alloy 25 Strip TB00 (C17200): High-Strength, High-Conductivity Copper Alloy