Ab Initio Simulation of Low‑Energy Radiation Response in Si, Ge, and Si/Ge Superlattices
Abstract
Using ab initio molecular dynamics, we examine how low‑energy ion irradiation affects bulk silicon (Si), bulk germanium (Ge), and a Si/Ge superlattice (SL). The study reveals that Ge atoms at the SL interface retain a displacement resistance similar to bulk Ge, whereas Si atoms near the interface exhibit a higher displacement threshold than bulk Si, indicating improved radiation tolerance. Defect generation mechanisms differ between the bulk and SL structures, with the SL producing more complex defect clusters. Calculations of defect formation energies and migration barriers demonstrate that point defects in the SL are harder to form and vacancies are less mobile. These findings suggest that Si/Ge SLs are promising for electronic and optoelectronic devices operating in radiation‑rich environments.
Background
In recent years, the Si/Ge superlattice has emerged as a versatile platform for next‑generation electronic and optoelectronic devices, driven by its tunable band structure and enhanced carrier mobility. Applications span fast photodiodes for optical communication, microelectronics, solar cells, and space‑borne components. However, exposure to high‑energy ions in space can alter the optical and electronic properties of these materials, leading to device degradation. Consequently, understanding the radiation response of Si/Ge SLs under extreme conditions is essential.
Experimental work has documented the superior radiation resistance of Si/Ge SLs compared to bulk Si. For instance, electron irradiation studies on monolayer Ge‑embedded SLs showed reduced photoluminescence degradation relative to bulk silicon, while 2 MeV proton irradiation of Ge quantum‑dot‑in‑SL structures revealed exceptional tolerance. Similar trends were observed in Ge quantum‑well devices on Si/Ge multilayers and in thermoelectric measurements, where ion fluence increased the figure of merit by enhancing phonon scattering and electronic transport. Despite these insights, a comprehensive atomistic understanding of defect formation and evolution in Si/Ge SLs remains lacking.
Ab initio molecular dynamics (AIMD) offers a powerful tool for probing radiation damage at the atomic scale, providing interatomic potentials derived from first‑principles electronic structure calculations. Unlike classical MD, AIMD captures charge transfer and electronic screening effects, enabling accurate determination of threshold displacement energies (Ed) and defect configurations. In this work, we employ AIMD to compare low‑energy displacement events in bulk Si, bulk Ge, and a Si2/Ge2 SL, identify the mechanisms underlying their distinct radiation behaviors, and quantify defect formation and migration energetics.
Methods
The displacement cascades were simulated with the SIESTA code. Norm‑conserving Troullier‑Martins pseudopotentials described the ion–electron interaction, while the local‑density approximation (LDA) in the Ceperley–Alder parameterization treated exchange‑correlation effects. Valence states were expanded in a single‑ζ plus polarization (SZP) basis set, with a 1 × 1 × 1 k‑point mesh and a 60 Ry cutoff. The model supercell for the SL comprised 288 atoms arranged in two Si layers alternating with two Ge layers (Si2/Ge2). Figure 1 illustrates the geometries of bulk Si and the Si/Ge SL.
A primary knock‑on atom (PKA) was selected and given kinetic energy to initiate a recoil event. If the PKA returned to its lattice site, the simulation was repeated at a higher energy with 5 eV increments; once the PKA remained displaced, the threshold was refined to 0.5 eV precision. For each element, we examined four to five crystallographic directions in the bulk and SL. All runs used the NVE ensemble and were limited to 1.2 ps to avoid numerical instability.

Schematic view of geometrical structures of a bulk Si and b Si/Ge superlattice. The blue and green spheres represent Si and Ge atoms, respectively.
Results and Discussion
The Displacement Events in Bulk Silicon and Germanium
Our AIMD calculations yielded lattice constants of 5.50 Å for bulk Si (matching the experimental 5.43 Å and theoretical 5.48 Å) and 5.71 Å for bulk Ge (in line with the experimental 5.77 Å and theoretical 5.65 Å). Table 1 summarizes the threshold displacement energies (Ed) and the resulting defect structures, while Figures 2 and 3 depict the damage configurations for Si and Ge, respectively.

a–d Schematic view of geometrical structures of damage Si after recoil events. The green and red spheres denote vacancy and interstitial defects, respectively. VSi: silicon vacancy; Siint: silicon interstitial.

a–d Schematic view of geometrical structures of damage Ge after recoil events. The red and blue spheres represent vacancy and interstitial defects, respectively. VGe: germanium vacancy; Geint: germanium interstitial.
For bulk Si, the calculated Ed values are close to experimental measurements: 21 eV for [001], ~47.6 eV for [110], and ~12.9 eV for [111]. The primary defect type in all cases is a Frenkel pair (vacancy plus interstitial). Our Ed for [110] (47 eV) exceeds the classical MD value (24 eV), reflecting the inclusion of charge‑transfer effects in AIMD. The displacement mechanisms vary: along [111], the PKA scatters to an interstitial site while the displaced atom returns to its lattice site; along [001], a more complex sequence of exchanges produces two vacancies and two interstitials; and along [110], multiple collisions lead to a cluster of Frenkel pairs. These results confirm that the [110] direction is the most resistant to displacement in bulk Si.
Bulk Ge shows Ed values that align well with experiment and theory: ~18 eV for [001] and 9.5 eV for [111] and [1 1 1]. Displacement along [111] yields a simple interstitial formation, whereas along [110] the PKA exchanges positions with a neighboring Ge atom, creating one vacancy and one interstitial. As in Si, the [110] direction is the most difficult to displace. The overall defect landscape in bulk Si and Ge is dominated by Frenkel pairs.
The Displacement Events in Si/Ge Superlattice
We investigated the Si2/Ge2 SL by selecting PKA atoms adjacent to the Si/Ge interface. Table 2 lists the Ed values and associated defects, while Figures 4 and 5 illustrate the resulting configurations.

a–d Schematic view of geometrical structures of damage Si/Ge superlattice after Si recoil events. Blue and green spheres denote Si and Ge atoms; purple and red spheres represent vacancy and interstitial defects. VX and Xint indicate vacancies and interstitials (X = Si or Ge), while XY shows an atom occupying a Y lattice site.

a–e Schematic view of geometrical structures of damage Si/Ge superlattice after Ge recoil events. Blue and green spheres denote Si and Ge atoms; purple and red spheres represent vacancy and interstitial defects. VX and Xint indicate vacancies and interstitials (X = Si or Ge), while XY shows an atom occupying a Y lattice site.
In the SL, Si atoms are highly resistant along the [1 1 1] direction (Ed = 10 eV), while Si[001] and Si[00 1̅] require 46.5 eV and 42.5 eV, respectively, and generate complex antisite clusters. Ge atoms in the SL retain low Ed values along [111] and [1 1 1̅] (≈16 eV) similar to bulk Ge, but display higher thresholds along [001] (≈17 eV) and [00 1̅] (≈18 eV). Importantly, Ge[110] in the SL has a reduced Ed (8.5 eV) and yields a mixed defect cluster (vacancy, antisite, interstitial). These findings confirm that the SL enhances radiation resistance for Si and, to a lesser extent, for Ge, in agreement with previous experimental observations.
The Defect Formation Energy and Migration Barrier in Bulk Si, Ge, and Si/Ge Superlattice
We computed defect formation energies for vacancies, interstitials, and antisites in bulk Si, bulk Ge, and the SL using a 64‑atom supercell, 6 × 6 × 6 k‑point sampling, and a 500 eV cutoff. The results, shown in Table 3, indicate that VSi (3.60 eV) and VGe (2.23 eV) are the most favorable defects in their respective bulk materials, whereas the SL displays slightly higher formation energies for most defects, with VGe (2.73 eV) and VSi (2.85 eV) still being the lowest.
Migration barriers were evaluated for VGe and VSi adjacent to the SL interface using the nudged elastic band method (Table 4). Vacancies migrate more readily along the [111] direction in both bulk and SL, but the barriers are consistently lower in the bulk (e.g., VSi along [111]: 0.11 eV in bulk vs 0.12 eV in SL). In contrast, migration along [100] and [110] shows modest differences. These results suggest that vacancy mobility is suppressed in the SL, which could reduce defect clustering and swelling under irradiation.
Conclusions
Our AIMD investigation demonstrates that the displacement threshold energies in bulk Si and Ge are strongly anisotropic, with the [110] direction being the most resistant. In the Si/Ge SL, Si atoms exhibit enhanced resistance along [111] and [001] directions, while Ge atoms maintain bulk‑like thresholds except for a reduced value along [110]. Defect formation energies confirm that point defects are more difficult to create in the SL, and migration barriers indicate reduced vacancy mobility, especially along the most favorable [111] direction. These combined effects underpin the superior radiation tolerance of Si/Ge superlattices, making them attractive for devices that must endure harsh radiation environments.
Abbreviations
- AIMD:
Ab initio molecular dynamics
- Ed :
Threshold displacement energy
- FP:
Frenkel pair
- Ge:
Germanium
- Geint :
Germanium interstitial
- GeSi :
Germanium occupying the silicon lattice site
- LDA:
Local‑density approximation
- MD:
Molecular dynamics
- NVE:
Microcanonical ensemble
- PKA:
Primary knock‑on atom
- PL:
Photoluminescence
- QD:
Quantum dot
- QW:
Quantum well
- Si:
Silicon
- SIESTA:
Spanish Initiative for Electronic Simulations with Thousands of Atoms
- SiGe :
Silicon occupying the germanium lattice site
- Siint :
Silicon interstitial
- SL:
Superlattice
- SZP:
Single‑ζ basis sets plus polarization orbital
- VGe :
Germanium vacancy
- VSi :
Silicon vacancy
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