Congatec Unveils 20 Intel‑Powered Computer Modules for Advanced IoT Gateways and Edge Computing

Congatec, a leading provider of computer modules and single‑board computers, has launched 20 new computer‑on‑module (COM) families designed to power demanding IoT gateway and edge computing workloads. The modules are powered by 11th‑Gen Intel Core vPro, Xeon W‑11000E, and Celeron processors.

Highlighting the portfolio’s performance, the flagship COM‑HPC Client and COM Express Type 6 modules leverage Intel’s 10 nm SuperFin architecture in a dual‑package layout—separate CPU and PCH. These premium modules set a new bandwidth benchmark, offering up to 20 PCIe Gen 4.0 lanes to meet the demanding needs of real‑time IIoT gateways and intelligent edge tasks.

Handling these workloads, the modules support up to 128 GB DDR4 SO‑DIMM memory, integrated AI accelerators, and up to eight high‑performance CPU cores, delivering up to a 65 % boost in multithreaded throughput and a 32 % improvement in single‑thread performance. Visual, auditory, and graphics‑intensive tasks see performance gains of up to 70 % over previous generations, elevating immersive applications.

These GPU enhancements are especially valuable in medical contexts—surgery, medical imaging, and e‑health edge deployments—where the platform supports 8K HDR video for optimal diagnostics. Coupled with on‑board AI and Intel OpenVINO, clinicians can quickly analyze deep‑learning diagnostics.

The integrated Intel UHD graphics further enable up to four simultaneous 4K displays and can process up to 40 HD 1080p/30 fps streams for 360‑degree monitoring. These AI‑powered vision capabilities extend to factory automation, machine‑vision inspection, smart city infrastructure, collaborative robotics, and autonomous systems across logistics, agriculture, construction, and public transport.

Deep‑learning inference can run concurrently on the integrated GPU or on the CPU, leveraging Intel Deep Learning Boost to combine multiple instructions, thereby accelerating inference and enhancing situational awareness.

Both the COM‑HPC Client and COM Express Type 6 platforms include built‑in safety features essential for fail‑safe operation in mobile robots, autonomous vehicles, and stationary equipment. Real‑time performance is supported by RTOSes such as Real Time Linux and Wind River VxWorks, and the modules feature native hypervisor support from Real‑Time Systems—fully certified by Intel.

Customers receive a holistic ecosystem with extensive support. Additional real‑time features—Intel Time‑Coordinated Computing (TCC) and Time‑Sensitive Networking (TSN)—enable reliable IIoT and Industry 4.0 gateways. Robust security protections safeguard against cyber threats, making these platforms suitable for critical factory and utility environments.

The COM‑HPC Client B (120 mm × 120 mm) and the COM Express Basic Type 6 (125 mm × 95 mm) modules will ship with scalable 11th‑Gen Intel Core, Xeon, and Celeron CPUs, including variants rated for extreme temperatures from ‑40 °C to +85 °C. Both form factors accommodate up to 128 GB DDR4 SO‑DIMM memory at 3200 MT/s, with optional ECC. The COM‑HPC modules provide 20 PCIe Gen 4 lanes (x16/x4), while the COM Express models offer 16 PCIe Gen 4 lanes; designers also have the option of 20 PCIe Gen 3 lanes on COM‑HPC or 8 on COM Express.

For high‑speed NVMe storage, the COM‑HPC module offers a PCIe x4 interface to the carrier board, while the COM Express version includes an onboard NVMe SSD to fully exploit the native Gen 4 lanes. Additional storage can be attached via two SATA Gen 3 ports on COM‑HPC and four on COM Express.

The COM‑HPC module delivers two USB 4.0, two USB 3.2 Gen 2, and eight USB 2.0 ports, whereas the COM Express version complies with PICMG standards, providing four USB 3.2 Gen 2 and eight USB 2.0. Networking includes dual 2.5 GbE on COM‑HPC and a single GbE on COM Express, both TSN‑capable. Audio is supported via I²S and SoundWire on COM‑HPC, and HDA on COM Express. Comprehensive board support packages cover major RTOSes—Real‑Time Systems hypervisor, Linux, Windows, and Android.

The two 11th Gen Intel Core, Xeon and Celeron processor based COM‑HPC and COM Express Basic Type 6 modules are available in the following options: