SECO Unveils High‑Performance Solutions Powered by Intel 8th Gen Core U and 9th Gen Core H Processors

In tandem with Intel’s own release, SECO introduces a portfolio of solutions powered by Intel’s newest silicon: the 8th‑Generation Core U family (codenamed Whiskey Lake) and the 9th‑Generation Core H family (codenamed Coffee Lake Refresh).

The 8th‑Gen Core U series delivers rich feature sets and impressive performance‑per‑watt. With options ranging from dual‑ to quad‑core configurations, enhanced I/O bandwidth, and DDR4‑2400 memory support, these processors satisfy growing demands for graphics, audio, and compute, while leaving room to consolidate data and applications. Optimized software tools such as Intel’s Distribution of OpenVINO and Intel System Studio accelerate development of vision applications—facial recognition, people counting, object detection.

To translate this potential into a ready‑made form factor, SECO engineered the COMe‑C55‑CT6, a COM Express 3.0 Compact Type 6 module built around the 8th‑Gen Core and Celeron U‑series. It offers extensive connectivity—4× USB 3.1, 8× USB 2.0, and up to 8× PCI‑e ×1 lanes—and ships with Intel UHD Graphics 620 and two DDR4 SO‑DIMM slots supporting DDR4‑2400 up to 32 GB. Leveraging its low‑power, multi‑core architecture, the COMe‑C55‑CT6 is ideal for biomedical and medical devices, edge computing, digital signage & infotainment, HMI kiosks, transportation, and precision instruments.

The 9th‑Gen Core H series represents Intel IoT’s most powerful and flexible 45‑W class processors yet. Supporting Intel’s Distribution of OpenVINO and Intel Media SDK, the 4‑ to 6‑core chips provide expanded I/O bandwidth and DDR4‑2666 memory, delivering the throughput required to run multiple workloads and to serve as a foundation for intelligent devices and value‑added solutions.

SECO responds to market demands by building a COM Express solution and a Single‑Board Computer in mini‑ITX form factor on these cutting‑edge processors.

The COMe‑C08‑BT6 is a COM Express 3.0 Basic Type 6 module that now supports Intel 8th‑Gen Core/Xeon and 9th‑Gen Core/Xeon/Pentium/Celeron CPUs. With up to six cores, the module delivers unrivaled processing power. It incorporates an Intel Gen 9 LP graphics core with up to 48 execution units, 4× USB 3.0, 8× USB 2.0, 8× PCI‑e ×1 Gen 3, and a PEG ×16 Gen 3 interface. Dual SO‑DIMM slots accommodate up to 64 GB DDR4‑2666 (including ECC with Xeon and Core i3 + CM246 PCH). This platform excels in biomedical and medical devices, digital signage & infotainment, gaming, telco, HMI, and industrial automation/control.

For those preferring a single‑board computer, SECO offers the SBC‑C66‑mITX—a mini‑ITX SBC powered by Intel 8th‑Gen Core/Xeon and 9th‑Gen Core/Xeon/Pentium/Celeron CPUs. The board boasts robust graphics with Intel UHD Graphics 630/P630, supporting up to three independent displays simultaneously, and multiple video outputs (2× DP++, eDP 40‑pin, LVDS/S/D channel). Connectivity is comprehensive: 2× Gigabit Ethernet with AMT, IEEE 1588 and TSN via Intel I210, 2× USB 3.1, 4× USB 2.0, an NVMe SSD slot, a PCI‑e ×8 port (mechanical ×16), and a VPU High‑Speed Connector with 4× USB 3.1 and 2× PCI‑e ×4. Memory slots hold up to 128 GB DDR4 on 4× SO‑DIMM (ECC supported). Ideal for biomedical/medical devices, gaming, industrial automation/control, IIoT, and surveillance—SECO’s high‑performance, flexible edge solution.