TQ Introduces COM Express Compact Module Powered by 8th‑Gen Intel Core Embedded Processors

TQ has unveiled its latest COM Express Compact Module, now powered by the most recent 8th‑generation Intel Core embedded processors. Building on the mobile‑processor variants showcased at Embedded World 2019, the new module expands the lineup to include the i7‑8665UE, i5‑8365UE, i3‑8145UE, and Celeron 4305UE CPUs—each delivering dual‑ or quad‑core performance with a 15‑W TDP.

With four cores available for the first time in this power envelope—up from two cores on the 7th‑generation U series—the module offers a balanced mix of power efficiency and processing capability. All other technical specifications remain unchanged, ensuring a smooth transition for existing designs.

The memory interface supports fast DDR4‑2400, allowing a capacity range of 4 GB to 64 GB based on the chosen SO‑DIMM modules. Up to nine PCI Express 3.0 lanes (8 GT/s) can be routed to connect up to five peripherals, and the BIOS provides flexible lane configuration.

For the first time, the module incorporates USB 3.1 Gen 2, delivering transfer speeds of up to 10 Gb/s across four high‑speed ports. It also adds eMMC flash storage, available in 8 GB, 16 GB, 32 GB, 64 GB, and 128 GB options.

The COM Express Compact Module TQMx80UC measures 95 × 95 mm and uses a Type 6 pinout. It complies with PICMG COM.0 R3.0 and is designed to fit the new TQ mainboard MB‑COME6‑3. When combined with an 11 mm heat spreader and heatsink, it forms an ideal evaluation platform.

The STKx80UC starter kit is available to accelerate early testing of performance and functionality. Customers can customize the kit with their preferred processor, memory, and display options.