Congatec Unveils 8th‑Gen Intel Core Embedded Boards with 15‑Year Availability

Congatec has launched a new family of embedded boards powered by Intel’s 8th‑Generation Core Mobile processors. These solutions are available as COM Express Type‑6 modules, 3.5‑inch single‑board computers (SBCs), and Thin Mini‑ITX motherboards.

Compared with earlier U‑Series embedded CPUs, the new cores deliver up to a 58% performance lift. The boost comes from a jump from two to four cores and an upgraded micro‑architecture that handles multitasking more efficiently. Optional Intel Optane memory 2 and native USB 3.1 Gen2 (10 Gbps) further accelerate everyday workloads.

Designed for demanding, space‑constrained environments, the boards feature the high‑end Core i7, Core i5, Core i3, and Celeron families. For the first time in the industry, congatec guarantees a 10‑ to 15‑year supply window, meeting the longevity demands of transport, mobility, medical, and industrial control sectors.

Key specifications include:

• Dual DDR4‑SODIMM slots, 2400 MT/s, up to 64 GB total
• USB‑C port supporting DisplayPort++ and single‑cable power, video, and touch for the SBCs
• Three independent 60 Hz UHD displays (4096×2304)
• Gigabit Ethernet with optional TSN support
• 15 W TDP, scalable from 10 W (800 MHz) to 25 W (4.6 GHz Turbo)

With 15 W power consumption and the ability to run multiple operating systems on one platform, these boards offer a balanced mix of performance, efficiency, and future‑proofing for embedded applications.