IBASE Launches Robust COM Express Modules (ET875 & ET870) Supporting -40°C to +85°C for IoT & Industrial Applications

IBASE Technology, a trusted name in embedded solutions, announces the new COM Express Type 10 (ET875) and Type 6 (ET870) modules. Built on Intel’s Atom E3900, Pentium N4200, and Celeron N3350 processors, these mini‑modules deliver the performance and power efficiency required for demanding IoT, gaming, medical imaging, and industrial control systems.

Key features include:

Wide operating temperature range: –40 °C to +85 °C, ensuring reliable operation in harsh environments.
Long‑term availability guarantees stability for mission‑critical deployments.
Dual serial ports, four high‑speed PCI‑e Gen 2 lanes, and TPM 2.0 for secure data encryption and management.

Specifications:

ET875 (84 × 55 mm) – Intel Gen 9‑LP SoC with integrated HD graphics (18 execution units). Supports two independent displays (1 × DD + 1 × LVDS or 1 × eDP) and up to 32 GB eMMC storage. Interfaces: 2 × USB 3.0/3.1, 8 × USB 2.0, 2 × SATA III (via IP417 carrier).
ET870 (95 × 95 mm) – Intel Gen 9 SoC with integrated HD graphics. Supports 2 × DDI and 1 × 24‑bit dual‑channel LVDS or eDP displays. Interfaces: 3 × USB 3.0, 4 × USB 2.0, 2 × SATA III (via IP419 carrier).

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