Infineon Introduces Compact, Industrial-Grade eSIM for Reliable IoT Connectivity
In the era of machine‑to‑machine (M2M) communication, seamless data collection and transmission are essential. Infineon Technologies addresses this need with an industrial‑grade embedded SIM (eSIM) housed in a miniature wafer‑level chip‑scale package (WLCSP), enabling manufacturers—from vending machines to remote sensors and asset trackers—to build IoT devices that are secure, reliable, and efficient.
Adopting eSIM technology offers clear benefits for industrial connectivity: the tiny footprint increases design flexibility; a single SKU simplifies manufacturing and global logistics; and end‑users gain the freedom to switch carriers at any time, whether to improve network quality or secure better contracts.
Delivering high‑quality performance in such a small form factor is challenging, especially under harsh conditions. Infineon’s latest offering, the SLM 97 security controller in a 2.5 × 2.7 mm WLCSP, supports an extended temperature range of –40 °C to 105 °C and complies fully with the latest GSMA eSIM specifications. This combination of durability, security, and zero‑defect focus makes Infineon’s solution ideal for demanding industrial IoT applications.
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