Renesas Licenses 3db Access Ultra‑Wideband Technology for Secure IoT Connectivity

Renesas Licenses 3db Access Ultra‑Wideband Technology for Secure IoT Connectivity

Renesas Electronics has entered a memorandum of understanding (MoU) with Switzerland‑based fabless semiconductor company 3db Access to license its secure ultra‑wideband (UWB) technology. The partnership aims to embed 3db Access’s proven UWB chips into Renesas’ microcontrollers (MCUs) and RF connectivity solutions, expanding secure positioning and access across a wide spectrum of devices.

Following the rollout of Apple’s UWB‑enabled iPhone, demand for the technology has surged. Renesas sees UWB as a catalyst for adding secure access to smart homes, Industry 4.0, mobile computing, connected vehicles, and the broader Internet of Things (IoT) ecosystem. Meanwhile, 3db Access already powers key‑fob solutions for automotive leaders such as Hella and Marquardt, and is developing next‑generation multi‑receiver UWB chips.

Technical Advantages

Renesas will augment its MCUs with 3db Access’s field‑tested, secure ranging UWB chips that support the IEEE 802.15.4z dual HRP/LRP (high‑rate pulse/low‑rate pulse) standard. The architecture delivers up to a 10× reduction in power consumption when operating in LRP mode, making it ideal for battery‑powered wearables and mobile devices.

Boris Danev, CEO of 3db Access, highlighted the compactness of their silicon: a 65‑nm process die occupies only 3.8 mm², the smallest among competing UWB ICs. This small footprint, combined with provable security, positions the technology for a wide array of IoT applications.

Strategic Vision

Renesas’ VP of Engineering, Amit Bavisi, explained that while UWB had been part of the IDT portfolio for low‑power motion sensors, the technology’s recent maturation required a deeper partnership. "With UWB now widely available in smartphones, the dynamics have shifted," he said. "We needed a mature solution that could meet IEEE compliance and leverage LRP’s power‑efficiency advantages."

Renesas’ Zurich team has long admired 3db Access’s rapid growth and technical prowess. The collaboration will enable customers to accelerate development in indoor positioning, mobile payments, and asset tracking, combining Renesas’ global operations with 3db Access’s specialized IP to create the smallest, highest‑performance secure ranging systems.

Initial focus will be on mobile devices, prioritizing secure access and payments. The joint effort is expected to deliver dual HRP/LRP chips by year’s end, supporting both Apple’s high‑rate pulse (HRP) ecosystem and 3db Access’s low‑rate pulse (LRP) approach.

Industry Impact

Apple’s introduction of UWB in the iPhone sparked a wave of interest among semiconductor leaders. Danev noted that Apple’s HRP implementation contrasts with 3db Access’s LRP technology used in Volkswagen’s Golf Mk 8 and ID.3 key fobs. "LRP offers low cost, minimal die area, and provable security," he added, "while HRP compatibility opens doors to Apple’s broader ecosystem."

The partnership will enable a dual‑mode chip that can transmit both HRP and LRP pulses, sharing the same channels and MAC layers but differing only in digital post‑processing. This design keeps LRP’s footprint to 10% of the chip, significantly reducing power usage compared to HRP’s extensive digital processing.

Renesas and 3db Access are still negotiating the terms of their collaboration. While the agreement is not exclusive, both companies seek to expand UWB solutions across the IoT market. No definitive investment commitments have been disclosed, and discussions continue to shape the future of this partnership.