Microchip Launches Secure, Cloud‑Connected IoT Development Boards for Rapid Prototyping

Microchip Technology Inc. introduces a comprehensive suite of IoT solutions that enable rapid prototyping through seamless cloud connectivity across its integrated microcontroller portfolio.

Designing an IoT system requires selecting the right microcontroller and connectivity protocol for your use case. Microchip’s new full‑stack embedded development line offers countless combinations, from ultra‑small PIC and AVR MCUs ideal for sensors and actuators, to robust 32‑bit MCU gateway and MPU solutions that power edge computing. Supported connectivity spans Wi‑Fi, Bluetooth, and 5G narrowband, all fortified by the Trust Platform’s CryptoAuthentication family.

IoT Design

The first step in any IoT project is choosing the development kit that aligns with your prototype goals. Building a cloud‑connected system from scratch can be daunting, costly, and time‑consuming, demanding expertise across multiple engineering disciplines. Today’s developers grapple with longer development cycles and escalating security risks.

IoT sensor networks and intelligent devices are set to permeate homes, transportation, communication systems, wearables, and even the human body, enabling data exchange at unprecedented scales. Capitalizing on these opportunities hinges on streamlined workflows and modular components.

Typical IoT projects fall into three categories:

1. Cloud‑connected systems that rely on dedicated server software for data analysis.
2. Local‑network projects that communicate over an intranet.
3. Gateway solutions that bridge legacy systems to the Internet.

Prototyping platforms play a critical role in accelerating innovation, simplifying the supply chain, and empowering a broader range of creators to develop viable IoT solutions.

Microchip Solutions

"IoT adoption remains slower than expected," says Oyvind Strom, Marketing Director at Microchip. "Many customers are hesitant to embrace full IoT stacks. That’s why we focus on edge nodes and gateways that prioritize ease of use," he explains.

Microchip’s security hardware safeguards against cyber‑attacks and counterfeit products, ensuring end‑to‑end protection for connected devices.

New, intelligent, connected, and secure rapid‑prototyping solutions include:

• Four Wi‑Fi development platforms built on the PIC and AVR families.
• Two Bluetooth prototyping boards for PIC and AVR lines.
• An IoT gateway that integrates Amazon Greengrass and Azure IoT services.
• LTE‑M/NB‑IoT kits powered by Sequans Monarch chips for 5G cellular connectivity.

Each kit emphasizes user‑friendly design and swift development, suitable for industrial, medical, consumer, agricultural, and retail applications where security is paramount. The breadth of connectivity options and the full range of microcontroller performance levels make these solutions scalable across diverse markets.

"Customers can choose between cloud‑enabled or cloud‑free IoT models. Cloud computing is one of the fastest‑growing sectors, with Google, Amazon, and Microsoft as leaders. We’re partnered with all three," Strom adds.

Microchip’s portfolio includes the PIC‑IoT WA and AVR‑IoT WA boards—new PIC and AVR MCU platforms developed with AWS. These boards let designers connect IoT sensor nodes to AWS IoT Core via Wi‑Fi in less than 30 seconds after plugging the board into a PC.

Both boards feature built‑in temperature and light sensors for demos. A microbus expansion socket supports over 300 click‑board sensors available in Microchip’s ecosystem (Figure 1).

Figure 1: PIC/AVR‑IoT WA board [Source: Microchip]

The SAM‑IoT WG board connects Google Cloud IoT Core with the SAM‑D21 Arm Cortex® M0+ 32‑bit microcontroller (Figure 2).

Figure 2: SAM‑IoT WG [Source: Microchip].

The Azure‑IoT SAM MCU platform integrates Azure IoT SDKs with Microchip’s MPLAB X ecosystem, offering advanced computing power and on‑board AI capabilities for predictive maintenance and vision applications.

"High‑end IoT nodes—such as those performing on‑board AI or advanced vision—are ideal candidates for this platform," Strom notes.

Bluetooth remains in high demand, especially for industrial maintenance and repair. The PIC‑BLE and AVR‑BLE boards, based on PIC and AVR microcontrollers, connect to mobile devices via BLE gateways and cloud services.

Embedded secure‑element ICs provide a root of trust from device to cloud, ensuring only authorized connections.

Figure 3: PIC/AVR‑BLE board [Source: Microchip]

Developers can use apps like LightBlue (Google Play or iOS App Store) to explore and program the board’s onboard sensors—temperature, light, and a 3‑axis accelerometer—and add external click‑board sensors (Figure 4).

Figure 4: The LightBlue app

While Wi‑Fi and BLE cover many use cases, a dedicated gateway is essential for closed or high‑security networks. The AWS Greengrass gateway, built on the ATSAMA5D27‑WLSOM1 Wireless System on Module, combines the SAMA5D2 MPU, WILC3000 Wi‑Fi module, Bluetooth, and MCP16502 PMIC.

"Greengrass delivers local cloud computing, enabling near‑real‑time responses and operation even when internet connectivity is lost," Strom explains.

Microchip’s LTE‑M/NB‑IoT Development Kit, in partnership with Sequans, leverages Monarch chips for global low‑power cellular coverage, supporting both LTE‑M and NB‑IoT standards (Figure 5).

For direct cloud transmission, LTE‑M/NB‑IoT eliminates the need for an intermediary gateway, positioning Microchip to serve customers worldwide as 5G networks expand.

Sequans’ 5G technology is compatible with Americas, Europe, Japan, and China, ensuring broad network support for Microchip’s LTE‑M/NB‑IoT solutions.

Figure 5: LTE or M/NB‑IoT development kit [Source: Microchip].

Microchip’s new IoT solutions are backed by its extensive development ecosystem centered on MPLAB X IDE. Code generators such as MPLAB X Code Configurator (MCC) accelerate application code creation for PIC and AVR devices, while Harmony libraries support all 32‑bit solutions, streamlining development across the board.