KEMET Launches KC‑LINK™ EIA 3640 SMD Ceramic Capacitors: Unmatched Performance for High‑Speed Wide Bandgap Power Converters

FORT LAUDERDALE, — KEMET Corporation, a global leader in electronic components, today unveiled its complete KC‑LINK™ EIA 3640 series of surface‑mount ceramic capacitors, designed to meet the demanding requirements of fast‑switching wide‑bandgap (WBG) power devices.

These capacitors deliver industry‑leading ripple‑current capability, allowing power converters to operate at higher voltages, temperatures, and frequencies while achieving superior efficiency and power density. Ideal for DC‑link, snubber, resonant, and wireless‑charging circuits, the KC‑LINK line supports DC‑link power supplies, resonant converters, and 5G base‑station power modules.

Available in capacitances from 4.7 nF to 220 nF and voltage ratings of 500 V to 1,700 V, the devices are built on KEMET’s proven Class I C0G Base Metal Electrode (BME) dielectric. This technology guarantees exceptional capacitance stability across temperature and voltage, and provides high ripple‑current performance. The series also features ultra‑low ESR and ESL, and operates from –55 °C to +150 °C, making them suitable for high‑density, high‑temperature power assemblies.

“Designers demand capacitors that can withstand extreme temperatures and voltages while maintaining stable capacitance and high ripple‑current capability,” said Dr. John Bultitude, Vice President and Technical Fellow at KEMET. “KC‑LINK delivers all of that in a single surface‑mount solution, enabling designers to boost power efficiency and density in applications such as 5G base stations and electric‑vehicle powertrains.”

The series is available in both commercial and automotive AEC‑Q200 grades, is lead‑free, RoHS‑compliant, and meets REACH regulations. Its robust mechanical construction eliminates the need for lead frames, reducing ESL and enabling higher operating frequencies for greater miniaturization.

For even higher power density, KEMET offers the KONNEKT™ technology, which uses Transient Liquid Phase Sintering (TLPS) to create a lead‑less multi‑chip package. When paired with KC‑LINK, KONNEKT delivers low‑loss, low‑inductance performance capable of handling hundreds of kilohertz ripple currents.

For more information, visit www.kemet.com/KC‑LINK.