E-20 Beryllium Composite: Ultra‑Light, High‑Strength & Thermally Stable
Beryllium and beryllium oxide metal matrix composites provide outstanding stiffness-to-weight ratios with thermal cycle reliability over a broad temperature range. The high elastic modulus of helps absorb vibrations, lowering the material fatigue of attached modules and wire bonds.
E-Materials offer high thermal conductivity and low thermal expansion. Their thermal expansion can be adjusted to match that of other materials, such as silicon, gallium arsenide and various ceramics. Features include:
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 23.0 °C | 2.05 g/cm³ |
Mechanical
| Property | Temperature | Value |
|---|---|---|
Elastic modulus | 23.0 °C | 289 GPa |
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 9.5E-6 - 1.1E-5 1/K | ASTM E228, ASTM E289 |
Specific heat capacity | 23.0 °C | 6615 J/(kg·K) | |
Thermal conductivity | 23.0 °C | 200 W/(m·K) | |
Thermal diffusivity | 23.0 °C | 14.78 mm²/s |
Chemical properties
| Property | Value |
|---|---|
Beryllium | BeO: 25.8-32.25% |
Technological properties
| Property | ||
|---|---|---|
| Application areas | Microelectronics - electronic heat sinks and chill plates, Aerospace - aerospace applications and components, Semiconductor - power devices | |
Composite material
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