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E-60 Beryllium: Superior Stiffness, Thermal Conductivity & Low Expansion for Advanced Electronics

Beryllium and beryllium oxide metal matrix composites provide outstanding stiffness-to-weight ratios with thermal cycle reliability over a broad temperature range. The high elastic modulus of helps absorb vibrations, lowering the material fatigue of attached modules and wire bonds.


E-Materials offer high thermal conductivity and low thermal expansion. Their thermal expansion can be adjusted to match that of other materials, such as silicon, gallium arsenide and various ceramics. Features include:


  • Low weight - density
  • High strength
  • High modulus
  • Excellent thermal expansion
  • Excellent thermal conductivity

    Properties

    General

    PropertyTemperatureValue

    Density

    23.0 °C

    2.51 g/cm³

    Mechanical

    PropertyTemperatureValue

    Elastic modulus

    23.0 °C

    313 GPa

    Thermal

    PropertyTemperatureValueComment

    Coefficient of thermal expansion

    23.0 °C

    6.5E-6 - 7.9E-6 1/K

    ASTM E228, ASTM E289

    Specific heat capacity

    23.0 °C

    5275 J/(kg·K)

    Thermal conductivity

    23.0 °C

    210 W/(m·K)

    Thermal diffusivity

    23.0 °C

    15.84 mm²/s

    Chemical properties

    PropertyValue

    Beryllium

    BeO: 69.4-73.2%

    Technological properties

    Property
    Application areas

    Microelectronics - electronic heat sinks and chill plates, Aerospace - aerospace applications and components, Semiconductor - power devices


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