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DECLAFOR 1015 TD1 – Advanced CuNi7.5Sn5Te Alloy for High-Performance Applications

Connectivity and free-machining alloy.


Spinodal hardening, ageable alloy with outstanding strength and thermal stress relaxation properties.

Properties

General

PropertyTemperatureValue

Density

23.0 °C

8.8 g/cm³

Dimension

PropertyValue

Dimensions

Available size round products (mm): 1-14

Mechanical

PropertyTemperatureValue

Elastic modulus

23.0 °C

115 GPa

Elongation

23.0 °C

7 %

Hardness, Brinell

23.0 °C

137 - 160 [-]

Hardness, Rockwell C

23.0 °C

0 - 3 [-]

Hardness, Vickers

23.0 °C

140 - 160 [-]

Tensile strength

23.0 °C

460 - 500 MPa

Yield strength

23.0 °C

370 - 480 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.72E-5 1/K

for 20-200°C

Thermal conductivity

23.0 °C

55 W/(m·K)

for 20-200°C

Electrical

PropertyTemperatureValue

Electrical conductivity

23.0 °C

8.00E+6 S/m

Technological properties

Property
Application areas

Summary of typical applications: Connectors, precision mechanical & electrical parts

Corrosion properties

Corrosion resistance rating: 4 out of 5

General machinability

Machinability: 60 %

Processing history

Condition: TD1


Metal

  1. AISI 1015 Hot Rolled Steel – Key Properties & Applications
  2. AISI 1015 Cold Drawn Low Carbon Steel – Properties & Specs
  3. ASTM A513 Grade 1015 Steel – Normalized Low‑Carbon, High‑Strength Material
  4. ASTM A513 Grade 1015 DOM Stress-Relieved Steel – Key Properties & Applications
  5. ASTM A513 Grade 1015 Steel – As-Welded Performance & Properties
  6. ASTM A513 Grade 1015: Durable Low‑Carbon Steel with Superior Mechanical Properties
  7. ASTM A513 Grade 1015 Sink-Drawn Steel: Specifications & Properties
  8. DECLAFOR 1015 TDX: High-Performance CuNi7.5Sn5Te Alloy for Superior Strength and Thermal Stress Relief
  9. DECLAFOR 1015 TH1 – Advanced CuNi7.5Sn5Te Alloy with Superior Strength and Thermal Stability
  10. DECLAFOR 1015 THX – High‑Performance CuNi7.5Sn5Te Alloy for Advanced Connectivity and Free‑Machining