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EN 12167 Grade CuNi2Si R600: High-Performance Hardenable Copper Alloy

CuNi2Si, mat. No CW111C, is counted among hardenable, low alloyed copper alloys. To the comparable make CuBNi2Si, mat. No 2.0855, acc. to DIN 17666 : 1983-12 applies: The material shows favorable electrical and thermal conductivity, corrosion resistance, high fatigue and creep resistance as well as favorable spring properties. CuNi2Si is in hardened condition resistant to stress corrosion. Temperature for removal of workhardening approximates 450°C. Strength still increases at low-temperature range. Processing properties: hot and cold forming: good machinability: moderately soft soldering: good hard soldering: moderately gas shielded welding: moderately burnishing: good Application: Particularly for aerial line material, such as clamps, mounting links, nuts, high-strength and corrosion resistant screws. Furthermore for wire ropes in electrical overhead line construction, bearing bushings, roller bearing cages, valve guide bushings and springs. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)

Properties

General

PropertyTemperatureValue

Density

20.0 °C

8.8 - 8.88 g/cm³

Mechanical

PropertyTemperatureValue

Elastic modulus

20.0 °C

130 - 143 GPa

Elongation

20.0 °C

10 %

Elongation A100

20.0 °C

4 %

Elongation A11.3

20.0 °C

6 %

Poisson's ratio

20.0 °C

0.34 [-]

Tensile strength

20.0 °C

600 MPa

Yield strength Rp0.2

20.0 °C

520 MPa

Thermal

PropertyTemperatureValue

Coefficient of thermal expansion

300.0 °C

1.6E-5 1/K

Specific heat capacity

20.0 °C

377 J/(kg·K)

Thermal conductivity

20.0 °C

67 - 200 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

1.00E+7 - 2.60E+7 S/m

Specific Electrical conductivity

34 - 45 % IACS

Chemical properties

PropertyValue

Iron

0.2 %

Lead

0.02 %

Manganese

0.1 %

Nickel

1.6 - 2.5 %

Silicon

0.4 - 0.8 %


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