EN 12163 Grade Cu-DLP H065 – High-Performance Deoxidized Copper for Precision Engineering
Cu-DLP, mat. No CW023A, is a deoxidized copper with limited, low residual copper-content. To the comparable DIN-make SW-Cu, mat. No 2.0076 acc. to DIN 1787 : 1973-01 applies: Tensile strength and Brinell hardness are increasable by cold forming. SW-Cu is hydrogen resistant and shows the lowest thermal and electrical conductivity of the pure copper materials. Processing properties: hot forming: very good cold forming: very good machinability: unfavorable hard soldering: very good soft soldering: very good gas-shielded welding: good burnishing: very good Application: Preferably in apparatus engineering and construction trade. For the electrolytically tinned strip the coatings (Sn bright, Sn matt, Sn fuzed, SnPb) are listed by the application (better solderability, better corrosion resistance, reduction of the electrical contact resistance, better appearance) in the DIN EN 14436 : 2004-11 (Table 5)
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 20.0 °C | 8.9 - 8.94 g/cm³ |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elastic modulus | 20.0 °C | 129 - 132 GPa | |
Hardness, Brinell | 20.0 °C | 65 - 90 [-] | |
Hardness, Vickers | 20.0 °C | 65 - 95 [-] | |
Poisson's ratio | 20.0 °C | 0.34 [-] | |
Shear modulus | 23.0 °C | 48 GPa | Typical for Wrought Copper Pure / Low Alloyed Copper |
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 1.6E-5 - 1.8E-5 1/K | Typical for Wrought Copper Pure / Low Alloyed Copper |
Melting point | 965 - 1100 °C | Typical for Wrought Copper Pure / Low Alloyed Copper | |
Specific heat capacity | 20.0 °C | 385 - 386 J/(kg·K) | |
Thermal conductivity | 20.0 °C | 350 - 370 W/(m·K) |
Electrical
| Property | Temperature | Value |
|---|---|---|
Electrical conductivity | 20.0 °C | 5.20E+7 S/m |
Electrical resistivity | 20.0 °C | 1.9E-8 Ω·m |
Specific Electrical conductivity | 90 % IACS |
Chemical properties
| Property | Value |
|---|---|
Bismuth | 5E-4 % |
Copper | 99.9 % |
Lead | 5E-3 % |
Phosphorus | 0.01 % |
Metal
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