EN 12163 Grade Cu-DLP R200 – Premium Wrought Copper for Engineering Applications
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 20.0 °C | 8.9 - 8.94 g/cm³ |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elastic modulus | 20.0 °C | 129 - 132 GPa | |
Elongation | 20.0 °C | 33 - 42 % | |
Hardness, Vickers | 20.0 °C | 55 [-] | |
Poisson's ratio | 20.0 °C | 0.34 [-] | |
Shear modulus | 23.0 °C | 48 GPa | Typical for Wrought Copper Pure / Low Alloyed Copper |
Tensile strength | 20.0 °C | 200 - 250 MPa | |
Yield strength Rp0.2 | 20.0 °C | 40 - 100 MPa | |
Yield strength Rp1.0 | 50.0 °C | 60 MPa | |
100.0 °C | 55 MPa | ||
150.0 °C | 55 MPa | ||
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 1.6E-5 - 1.8E-5 1/K | Typical for Wrought Copper Pure / Low Alloyed Copper |
Melting point | 965 - 1100 °C | Typical for Wrought Copper Pure / Low Alloyed Copper | |
Specific heat capacity | 20.0 °C | 385 - 386 J/(kg·K) | |
Thermal conductivity | 20.0 °C | 350 - 352 W/(m·K) |
Electrical
| Property | Temperature | Value |
|---|---|---|
Electrical conductivity | 20.0 °C | 5.20E+7 S/m |
Electrical resistivity | 20.0 °C | 1.9E-8 Ω·m |
Chemical properties
| Property | Value |
|---|---|
Bismuth | 5E-4 % |
Copper | 99.9 % |
Lead | 5E-3 % |
Phosphorus | 0.01 % |
Metal
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