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EN 10263-4 Grade 22B2 Steel: Cold‑Drawn, Annealed for Spheroidized Carbides & Skin Pass

The cold-upsettable steel 22 B 2 can be cold-formed with a medium to high rate of forming according to the usual forming methods. It is used for screws, bolts and pressed parts of strength class 8.8 in the thick and medium dimension range.

Properties

General

PropertyTemperatureValue

Density

20.0 °C

7.82 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

-100.0 °C

217 GPa

20.0 °C

212 GPa

100.0 °C

207 GPa

200.0 °C

199 GPa

300.0 °C

192 GPa

400.0 °C

184 GPa

500.0 °C

175 GPa

600.0 °C

164 GPa

Poisson's ratio

20.0 °C

0.29 [-]

Typical for Low Carbon Steel

Reduction of area

20.0 °C

66 %

Tensile strength

20.0 °C

480 - 500 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

-100.0 °C

1.08E-5 1/K

20.0 °C

1.19E-5 1/K

100.0 °C

1.25E-5 1/K

200.0 °C

1.3E-5 1/K

300.0 °C

1.36E-5 1/K

400.0 °C

1.41E-5 1/K

500.0 °C

1.45E-5 1/K

600.0 °C

1.49E-5 1/K

Melting point

1480 - 1526 °C

Typical for Low Carbon Steel

Specific heat capacity

-100.0 °C

423 J/(kg·K)

20.0 °C

461 J/(kg·K)

100.0 °C

479 J/(kg·K)

200.0 °C

499 J/(kg·K)

300.0 °C

517 J/(kg·K)

400.0 °C

536 J/(kg·K)

500.0 °C

558 J/(kg·K)

600.0 °C

587 J/(kg·K)

Thermal conductivity

20.0 °C

39.6 W/(m·K)

100.0 °C

41 W/(m·K)

200.0 °C

41 W/(m·K)

300.0 °C

39.9 W/(m·K)

400.0 °C

38.1 W/(m·K)

500.0 °C

35.9 W/(m·K)

600.0 °C

33.6 W/(m·K)

Thermal diffusivity

20.0 °C

11 mm²/s

100.0 °C

10.6 mm²/s

200.0 °C

9.9 mm²/s

300.0 °C

9 mm²/s

400.0 °C

8.1 mm²/s

500.0 °C

6.9 mm²/s

600.0 °C

5.7 mm²/s

Electrical

PropertyTemperatureValue

Electrical resistivity

20.0 °C

2.63E-7 Ω·m

100.0 °C

3.12E-7 Ω·m

200.0 °C

3.85E-7 Ω·m

300.0 °C

4.7E-7 Ω·m

400.0 °C

5.71E-7 Ω·m

500.0 °C

6.88E-7 Ω·m

600.0 °C

8.25E-7 Ω·m

Magnetic

PropertyValueComment

Curie temperature

770 °C

Typical for Low Carbon Steel

Chemical properties

PropertyValue

Boron

1E-3 - 5E-3 %

Carbon

0.19 - 0.25 %

Manganese

0.5 - 0.8 %

Phosphorus

0.04 %

Silicon

0.4 %

Sulfur

0.035 %


Metal

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