Industrial manufacturing
Industrial Internet of Things | Industrial materials | Equipment Maintenance and Repair | Industrial programming |
home  MfgRobots >> Industrial manufacturing >  >> Industrial Internet of Things >> Embedded

TI Unveils Ethernet PHYs That Streamline Design and Boost Network Performance

Texas Instruments has launched two new Ethernet physical layer (PHY) transceivers, offering designers more compact and versatile options for both space‑constrained and time‑sensitive network (TSN) applications.

The DP83825I is a low‑power 10/100‑Mbps PHY that packs into a 3 × 3 mm QFN package—44 % smaller than comparable devices—while delivering a 150‑meter cable reach. Its reduced footprint and power consumption (under 125 mW) enable tighter system designs, lower operating costs, and the elimination of Ethernet repeaters.

Key power‑saving features include Energy‑Efficient Ethernet, Wake‑on‑LAN, and MAC‑level isolation, helping to free up thermal budget for other critical components.

The DP83869HM is the industry’s only gigabit PHY that supports both copper and fiber media, operates reliably up to 125 °C, and boasts an extended temperature range of –40 °C to 125 °C for fiber modes. With ESD immunity exceeding 8 kV (IEC 61000‑4‑2), it delivers robust performance in high‑temperature, static‑prone industrial environments such as factory floors.

It supports 1000Base‑X and 100Base‑FX Ethernet, offers copper‑to‑fiber conversion, and delivers TSN‑ready latency below 390 ns for both 1000Base‑T and 100Base‑TX. These capabilities give engineers the flexibility to build long‑reach, high‑speed networks that remain reliable under harsh conditions.

By integrating these PHYs, designers can streamline layouts, reduce power budgets, and achieve higher network performance without sacrificing reliability.

Embedded

  1. From Sports Glory to Factory Excellence: How Team Chemistry Fuels Industrie 4.0
  2. Optimizing Performance and Security in IoT Wearables: The Role of Advanced NOR Flash
  3. Mastering USB‑C: Design Challenges and Practical Solutions for High‑Speed Data and Power
  4. Bluetooth 5.1 SoC: Ultra‑Compact, Low‑Cost Solution for IoT Devices
  5. Low‑Power LED Drivers Empower Next‑Gen Automotive Lighting
  6. ADI Launches ADM2867E: Integrated Isolated RS‑485 Transceiver with DC/DC Converter for Space‑Saving Applications
  7. Blaize Unveils Pathfinder and Xplorer: GSP‑Based Edge AI Platforms Deliver 60x Efficiency and Code‑Free Development
  8. Designing 5G Devices: Selecting the Ideal Performance Band for Your Application
  9. Master Heat Sink Design: Proven Principles & 4 Essential Tips for Peak Performance
  10. Mastering 3D Printed Lattice Structures: Design, Properties, and Performance Insights