Boreas Launches BOS1901CW: Ultra‑Compact, Low‑Power Haptic IC for Wearables

Boreas Technologies has expanded its award‑winning low‑power piezoelectric driver portfolio with the BOS1901CW, a wafer‑level chip‑scale (WLCSP) solution engineered for high‑definition haptic feedback in mobile and wearable consumer electronics. With a footprint of just 2.1 × 2.2 × 0.6 mm and power consumption that is one‑tenth of the nearest piezoelectric competitor, the BOS1901CW is ideal for battery‑constrained devices such as buttonless smartphones, smartwatches, gaming controllers, and other portable gadgets.

Building on the success of the BOS1901CQ, which arrived in a 4 × 4 × 0.8 mm QFN package, the BOS1901CW remains a high‑voltage, low‑power piezo driver IC built around Boreas’ patented CapDrive technology. CapDrive’s scalable architecture delivers superior energy efficiency, minimal heat dissipation, and rapid response times—critical attributes for next‑generation haptic experiences.

Key attributes include:

• 10‑fold power savings versus standard piezo solutions, and 4‑to‑20‑fold savings over incumbent LRA and ERM technologies.
• Compact WLCSP package of 2.1 × 2.2 × 0.6 mm.
• Startup latency under 300 µs, enabling ultra‑fast, real‑time haptic feedback.
• Broad compatibility with a wide range of piezoelectric haptic actuators and third‑party effect libraries.
• Wide supply voltage window of 3 V to 5.5 V.

A plug‑and‑play development kit, the BOS1901‑KIT, is now available to accelerate product integration.