Tiny 3D Image Sensor Uses Time‑of‑Flight Technology

Tiny 3D Image Sensor Uses Time‑of‑Flight Technology

Infineon Technologies AG, in partnership with pmdtechnologies AG, has introduced the industry’s smallest and most powerful 3D image sensor—REAL3. Unveiled at CES 2020, this single‑chip solution represents Infineon's fifth‑generation time‑of‑flight (ToF) deep sensor, measuring just 4.4 × 5.1 mm while delivering the highest resolution depth data with minimal power draw.

The REAL3 chip’s compact footprint and low‑power operation make it ideal for a range of applications that demand accurate 3D imaging. From facial recognition payments on mobile devices to secure device unlocking, the sensor delivers reliable, high‑resolution data even in challenging lighting conditions.

The ToF technology measures depth, amplitude and phase difference of reflected light on a per‑pixel basis, constructing a detailed 3D image. This capability is critical for applications requiring precise 3D data, such as contactless payment authentication and depth‑based autofocus in cameras.

Key features of the REAL3 chip include:

• Exceptional performance in extreme lighting—from bright sunlight to complete darkness.
• Real‑time full‑3D mapping, enabling immersive augmented reality experiences.
• Enhanced camera functionalities such as auto‑focus, bokeh effects, and improved low‑light resolution.
• Low power consumption, extending battery life in mobile and wearable devices.

Production of the REAL3 sensor will commence in mid‑2020. Infineon also offers the IRS9100C illumination driver, part of a turnkey solution that further boosts performance while reducing size and cost.

With its unprecedented combination of size, power efficiency, and imaging fidelity, the REAL3 sensor sets a new benchmark for ToF technology across consumer electronics, automotive, and industrial sectors.