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AuSi2 Gold‑Silicon Solder: Hard‑as‑Rolled, Low‑Melting, High‑Performance

Gold-based solder alloy. Soft solders are characterized by a liquidus temperature <450°C. High precious metal-containing special soft solders are always used when the properties of the classic SnPb soft solders do not meet the desired requirements. This is the case in different areas of electronics and microelectronics. The gold base special soft solders are characterized by considerable strength values. At the same time, these materials have almost negligible plastic elongation. AuSi (1... 3%) is an introduced material for soldering Si semiconductor chips to the substrate (copper or metallized ceramics). With the special solder material AuSi3, connections of the highest stability and temperature cycle stability are achieved when soldering the Si chips to the system carrier or housing.

Properties

General

PropertyTemperatureValue

Density

20.0 °C

14.5 g/cm³

Mechanical

PropertyTemperatureValueComment

Elastic modulus

23.0 °C

74 - 81 GPa

Typical for Gold

Elongation

20.0 °C

0.5 - 3 %

Poisson's ratio

23.0 °C

0.42 [-]

Typical for Gold

Shear modulus

23.0 °C

26 GPa

Typical for Gold

Yield strength

20.0 °C

500 - 600 MPa

Thermal

PropertyTemperatureValueComment

Coefficient of thermal expansion

23.0 °C

1.4E-5 1/K

Typical for Gold

Melting point

1064 °C

Typical for Gold

Specific heat capacity

23.0 °C

126 - 138 J/(kg·K)

Typical for Gold

Thermal conductivity

20.0 °C

50 W/(m·K)

Electrical

PropertyTemperatureValue

Electrical conductivity

20.0 °C

3.30E+7 S/m

Electrical resistivity

20.0 °C

3.1E-8 Ω·m

Chemical properties

PropertyValue

Gold

98 %

Silicon

2 %


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