AuSi2 Gold‑Silicon Solder: Hard‑as‑Rolled, Low‑Melting, High‑Performance
Gold-based solder alloy. Soft solders are characterized by a liquidus temperature <450°C. High precious metal-containing special soft solders are always used when the properties of the classic SnPb soft solders do not meet the desired requirements. This is the case in different areas of electronics and microelectronics. The gold base special soft solders are characterized by considerable strength values. At the same time, these materials have almost negligible plastic elongation. AuSi (1... 3%) is an introduced material for soldering Si semiconductor chips to the substrate (copper or metallized ceramics). With the special solder material AuSi3, connections of the highest stability and temperature cycle stability are achieved when soldering the Si chips to the system carrier or housing.
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 20.0 °C | 14.5 g/cm³ |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elastic modulus | 23.0 °C | 74 - 81 GPa | Typical for Gold |
Elongation | 20.0 °C | 0.5 - 3 % | |
Poisson's ratio | 23.0 °C | 0.42 [-] | Typical for Gold |
Shear modulus | 23.0 °C | 26 GPa | Typical for Gold |
Yield strength | 20.0 °C | 500 - 600 MPa |
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 1.4E-5 1/K | Typical for Gold |
Melting point | 1064 °C | Typical for Gold | |
Specific heat capacity | 23.0 °C | 126 - 138 J/(kg·K) | Typical for Gold |
Thermal conductivity | 20.0 °C | 50 W/(m·K) |
Electrical
| Property | Temperature | Value |
|---|---|---|
Electrical conductivity | 20.0 °C | 3.30E+7 S/m |
Electrical resistivity | 20.0 °C | 3.1E-8 Ω·m |
Chemical properties
| Property | Value |
|---|---|
Gold | 98 % |
Silicon | 2 % |
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