AuGe12: Premium Gold-Based Soft Solder Alloy
Gold-based solder alloy. Soft solders are characterized by a liquidus temperature <450°C. High precious metal-containing special soft solders are always used when the properties of the classic SnPb soft solders do not meet the desired requirements. This is the case in different areas of electronics and microelectronics. The gold base special soft solders are characterized by considerable strength values. At the same time, these materials have almost negligible plastic elongation. AuGe12 is u. a. as a mechanically highly durable, corrosion-resistant solder material for hermetically sealing ceramic IC packages and for connecting housing parts made of Cu and FeCoNi alloys at temperatures in the range of 400 to 500°C.
Properties
General
| Property | Temperature | Value |
|---|---|---|
Density | 20.0 °C | 14.7 g/cm³ |
Mechanical
| Property | Temperature | Value | Comment |
|---|---|---|---|
Elastic modulus | 20.0 °C | 69.3 GPa | |
Elongation | 20.0 °C | 1 % | |
Poisson's ratio | 23.0 °C | 0.42 [-] | Typical for Gold |
Shear modulus | 23.0 °C | 26 GPa | Typical for Gold |
Yield strength | 20.0 °C | 150 - 200 MPa |
Thermal
| Property | Temperature | Value | Comment |
|---|---|---|---|
Coefficient of thermal expansion | 23.0 °C | 1.4E-5 1/K | Typical for Gold |
Melting point | 1064 °C | Typical for Gold | |
Specific heat capacity | 23.0 °C | 126 - 138 J/(kg·K) | Typical for Gold |
Thermal conductivity | 20.0 °C | 44.4 W/(m·K) |
Electrical
| Property | Temperature | Value |
|---|---|---|
Electrical conductivity | 20.0 °C | 7.00E+6 S/m |
Electrical resistivity | 20.0 °C | 1.4E-7 Ω·m |
Chemical properties
| Property | Value |
|---|---|
Germanium | 12 % |
Gold | 88 % |
Metal
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