OmniVision Unveils Low‑Power 1.3‑MP OX01E10 SoC for Entry‑Level Rear‑View Cameras

OmniVision Technologies, Inc. introduces the 1.3‑MP OX01E10 SoC, engineered to provide superior imaging for entry‑level rear‑view cameras. The chip delivers reliable performance under varied lighting, all within a compact footprint and minimal power draw.

Its power usage drops over 35 % below that of competing solutions, keeping operating temperatures low. Importantly, the OX01E10 is the first entry‑level RVC sensor that eliminates the need for a metal heat sink, enabling the use of lightweight, plastic housing and driving down manufacturing costs.

The AEC‑Q100 Grade 2‑certified chip offers 1.3 MP resolution (1,340 × 1,020 pixels) at 30 fps and supports dual‑lane MIPI and 10‑bit DVP outputs.

Figure: OX01E10 function block diagram. (Source: OmniVision Technologies)

Built on OmniVision’s PureCel Plus pixel architecture, the sensor excels in low‑light scenarios, suppressing LED halos and delivering enhanced contrast even under bright illumination.

The SoC houses a 3 µm image sensor and a sophisticated ISP within a single 0.25‑inch optical package. By integrating the sensor and processor on one chip, OmniVision cuts PCB count, reduces size, and lowers production costs—all while maintaining low‑light sensitivity and ultra‑low power.

Additional features include dual on‑screen overlay layers for driver guidance, built‑in distortion correction, and OmniVision’s dual‑conversion‑gain (DCG) technology. DCG delivers a 120 dB HDR range using just two exposures—one fewer than competitors—minimizing motion artifacts, cutting power usage, and enhancing low‑light imaging.

Samples are currently available, with full‑scale production slated for Q3 2020.

>> An earlier version of this article was originally published on our sister site, Electronic Products.